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LED (Light Emitting Diode) lamp filament without bonding wire

A technology of LED filament and no welding wire, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of LED filament luminescence and insufficient heat dissipation, so as to improve packaging reliability and production yield, reduce costs, The effect of improving the cooling effect

Active Publication Date: 2015-04-08
ZHEJIANG INTELED OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the problem of insufficient light emission and heat dissipation of LED filaments in the prior art, and provides a wire-free LED filament that omits welding wires, saves costs, and has a good heat dissipation effect.

Method used

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  • LED (Light Emitting Diode) lamp filament without bonding wire
  • LED (Light Emitting Diode) lamp filament without bonding wire
  • LED (Light Emitting Diode) lamp filament without bonding wire

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Embodiment

[0022] In this embodiment, a wire-free LED filament, such as figure 1 As shown, including a substrate 1, a circuit is arranged on the surface of the substrate. The circuit is composed of a number of connecting circuits 5. The connecting circuit includes two electric silver layers 6. The electric silver layers are made by sintering with a thick film process, and the electric silver layers are passed through The conductive circuit 7 is connected, and the conductive circuit is made of transparent conductive material or conductive paste. The connection circuits are disconnected from each other and are not connected to each other. The LED chip is connected to the adjacent connection circuit. The LED chip adopts a flip chip. The conductive silver layer is connected.

[0023] Both ends of the substrate are bonded with metal sheets, such as figure 1 and image 3 As shown, a roughened area 8 is provided on the surface of the metal sheet close to the rear end, and the roughened area ...

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Abstract

The invention relates to an LED (Light Emitting Diode) lamp filament without a bonding wire, and solves the problem of poor luminescence performance and heat dissipation of a traditional LED lamp filament. The lamp filament comprises a substrate, wherein a circuit is arranged on the surface of the substrate, LED chips are connected to the circuit, two ends of the substrate are connected with sheet metals, the circuit consists of a plurality of connecting circuits, each connecting circuit comprises two electric conduction silver layers which are connected through an electric conduction line, the LED chips are flip chips, and each LED chip is arranged between two adjacent connecting circuits for connecting the connecting circuits. The LED lamp filament has the advantages that a structure without the bonding wire is adopted, so that the cost is saved, the risks of the electric leakage and the dry joint of the LED since a porcelain nozzle has an impact on the LED chips in a welding process are greatly reduced, the packaging reliability and a production yield are greatly improved, and meanwhile the cost is lowered; and since the lamp filament and a lamp filament support are assembled in an embedding manner, the bad problems of the desoldering and the dry joint of the lamp filament of a light source in a traditional electric welding process can be avoided.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a wire-free LED filament. Background technique [0002] LED filament lamp, from the appearance point of view, is an incandescent lamp made of LED. It has: 1. Similar shape and light distribution curve to incandescent lamp; mature bulb technology, low price; 360-degree full-angle light, no aperture; high Fingerprint, high light efficiency; no need for independent heat dissipation and other characteristics. At the same time, there are many problems in the development of LED bulbs, the main restricting factor is the LED filament. The LED filament encapsulates multiple chips on a thin strip substrate, and the two sides are coated with fluorescent glue. At present, LED filaments are mainly fixed on the substrate by die-bonding glue, and then connected by soldering metal wires, but the metal wires will affect the light output, and the heat dissipation and reliability problems in this pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L25/075H01L33/48H01L33/64H01L33/58
CPCH01L33/48H01L33/62H01L33/64H01L33/642
Inventor 林成通王东海许献美李玉花朱颖颀
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH
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