High-temperature binder and preparation method thereof
A ceramic bond, high temperature technology, applied in the field of ceramic bond, to achieve the effect of high thermal expansion coefficient, good fluidity and low refractoriness
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Embodiment 1
[0010] A high-temperature vitrified bond consisting of the following weight fractions: SiO 2 40 copies, B 2 o 3 35 parts, TiO 2 25 parts, MgO 5 parts, Li 2 O8 parts, CaCO 3 10 parts, Na 2 O 2 parts.
[0011] Fully mix the above materials in a high-energy ball mill, fully mix all raw materials in a ball mill, add water, ball mill for 5 hours, then stand for 2 hours, pour out the water, dry at 90°C, ball mill and sieve to prepare A vitrified bond is obtained.
Embodiment 2
[0013] A high-temperature vitrified bond consisting of the following weight fractions: SiO 2 42 copies, B 2 o 3 38 parts, TiO 2 28 parts, MgO 8 parts, Li 2 O13 parts, CaCO 3 16 parts, Na 2 O 5 copies.
[0014] Fully mix all raw materials in a ball mill, add water, ball mill for 8 hours, then stand for 2 hours, pour out the water, dry at 90°C, ball mill and sieve to prepare vitrified bond.
Embodiment 3
[0016] A high-temperature vitrified bond consisting of the following weight fractions: SiO 2 46 copies, B 2 o 3 45 parts, TiO 2 32 parts, MgO 10 parts, Li 2 O15 parts, CaCO 3 20 parts, Na 2 O 8 servings.
[0017] Fully mix all raw materials in a ball mill, add water, ball mill for 10 hours, then stand for 1 hour, pour out the water, dry at 100°C, ball mill and sieve to prepare vitrified bond.
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