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cooling module

A technology of heat dissipation module and heat sink, applied in lighting and heating equipment, cooling/ventilation/heating renovation, cooling/heating device of lighting device, etc. good question

Active Publication Date: 2018-01-30
SUNON ELECTRONICS KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the existing heat dissipation module 9, the joints between the two heat pipes 92, 93 and the fins 94 are located between the two fins 943 of the fins 94, rather than being directly connected in series between the two fins 943. At the center of the fins 943, the two fins 943 of each of the heat sinks 94 cannot effectively exert their heat dissipation effect, so that the heat dissipation efficiency of each of the heat sinks 94 is not good, and heat energy is easily accumulated between the two fins 943 situation
In addition, the two heat pipes 92, 93 are respectively assembled and positioned on the base body 91, so that the two heat pipes 92, 93 are not easy to maintain parallelism, so that the heat sinks 94 are respectively fitted by the two joint holes 942 The assembly action of the two heat pipes 92, 93 is even more difficult to carry out, so the existing heat dissipation module 9 also has the problem of poor assembly convenience

Method used

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Embodiment Construction

[0055] In order to make the above and other purposes, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:

[0056] Please refer to image 3 , 4 , 5, is the first preferred embodiment of the present invention, the heat dissipation module of the present invention generally includes a heat pipe 1, a first heat dissipation component 2 and a second heat dissipation component 3, the first heat dissipation component 2 and the second heat dissipation component The heat dissipation components 3 are respectively serially positioned at two ends of the heat pipe 1 . The heat dissipation module of the present invention can assist a heat source H (for example: an LED lamp) to dissipate heat, so that the heat source H can be maintained at a normal operating temperature.

[0057] The heat pipe 1 is made of a material with high thermal conduc...

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Abstract

A heat dissipation module, comprising a heat pipe and two heat dissipation components; the heat pipe has a first serial connection part, a connection part and a second serial connection part, the first serial connection part and the second serial connection part respectively connected to the two ends of the connecting part in a bent shape; the two heat dissipation components respectively have at least one heat dissipation fin, and the heat dissipation fins of the two heat dissipation components are respectively positioned obliquely in series on the first string of the heat pipe The connection part and the second serial connection part; wherein, an air flow channel is formed between the adjacent end edges of the two heat dissipation components, and the connection part of the heat pipe is located at one end of the air flow channel. Accordingly, the heat dissipation module of the present invention can effectively solve the problem that the conventional heat dissipation fins cannot fully exert the heat dissipation effect, resulting in poor heat dissipation efficiency.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module for assisting a heat source in heat dissipation. Background technique [0002] Please refer to figure 1 , 2 , is a heat dissipation module 9 disclosed in the Chinese patent No. 102630291 "cooling element for heat source". In the base body 91, to lead out the thermal energy of the base body 91, the two heat pipes 92, 93 pass through several cooling fins 94 in addition to form a cooling body 95, and any two adjacent cooling fins 94 are provided with a The spacer 96 enables any two adjacent cooling fins 94 to be spaced from each other without overlapping. Accordingly, the heat energy of the heat source contacted by the existing heat dissipation module 9 can pass through the base body 91 and the two heat pipes 92, 93, and then transfer to each of the heat sinks 94 and then overflow and cool, thereby achieving auxiliary heat source heat dissipation. Effect. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F21V29/74
Inventor 廖津均郑又嘉
Owner SUNON ELECTRONICS KUNSHAN
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