Manufacturing method of chemical nickel palladium gold plating plated with thick palladium
A production method and chemical nickel technology, which are applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of poor soldering performance, high production cost, poor performance of coating gold wire, etc. Good wire performance and soldering performance, reducing the use of highly toxic gold salts, and reducing production costs
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[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0020] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.
[0021] like Figure 1~2 Shown is a preferred embodiment provided by the present invention.
[0022] The preparation method of the chemical nickel-palladium-gold coating of the thick-plated palladium provided by the present embodiment is used to form a nickel-palladium-gold coating on a circuit board, and it comprises the following steps:
[0023] 1) Acid degreasing, use acid degreasing agent to clean the board surface of the circuit board, clear the oxide layer and oil ...
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