Force measurement sensor

Abstract

The invention provides a force measurement sensor. The force measurement sensor comprises a press head, a base, a sensitive element, a circuit board carrier, a lead fixing circuit board, a multi-functional circuit board, a lead, a conductive post, a conducting wire and a casing, wherein the circuit board carrier is made of a stainless steel material, is plated with copper or gold, and is welded on the sensitive element through laser welding or electronic beam welding, the lead fixing circuit board is directly welded and fixed on the other surface of the circuit board carrier through welding tin or a high-temperature solder, and the lead fixing circuit board is fixedly connected with the multi-functional circuit board through the conductive post. The force measurement sensor can be used for severe work environments, such as super-high or ultralow temperatures, violent impact and violent vibration, and meanwhile, can solve the high-precision force measurement problem of special environments requiring inorganic and organic substances and various bonding structures. The force measurement sensor has extremely actual meaning in solving the high-precision force measurement problem of complicated industrial environments, military equipment and aerospace and navigation environments.

Description

technical field [0001] The invention relates to a force measuring sensor, in particular to a sputtering thin film force measuring sensor suitable for extremely harsh working environments such as ultra-high / ultra-low temperature, severe impact and vibration. Background technique [0002] Force sensors are widely used in various fields such as industrial production, military equipment, aerospace and navigation. Although the existing force sensors have various structures, they all more or less need to be glued together. For example, the conversion of the force signal to the electrical signal is realized by pasting the resistance strain gauge on the sensitive element; another example, the lead wires drawn from the strain gauge also need to be fixed on the circuit board or the lead terminal, and in order to save space as much as possible and reduce the complexity of the structure Sex, the fixing method is also often glued. Although the bonding process is widely used, it has man...

AI Technical Summary

Problems solved by technology

In some vacuum environments, some types of glue also have potential risks such as decomposition and escape.

In addition, the bonded structure is prone to aging and corrosion in some industrial environments, which greatly reduces the performance and life of the sensor

In aerospace exploration activities, sensors that are directly in contact with the space environment must be able to withstand special requirements such as high vibration, high impact, ultra-high vacuum environment, and large temperature difference. The adhesive structure has yet to be fully verified, and metal materials, PCB circuits board (commonly used materials are epoxy substrates, but there are already mature inorganic substrates) and processing technology, but the welding process has been fully verified in previous aerospace exploration activities

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