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Light-emitting diode and its manufacturing method

A technology for light-emitting diodes and a manufacturing method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as the influence of epitaxial layer growth, and achieve the effects of improving light extraction efficiency and reducing crystal defects.

Active Publication Date: 2017-05-24
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the above process, the defects of the epitaxial layer grown directly on the bottom of the protrusion will still extend upward during the epitaxy process, and when a patterned sapphire substrate is used, the defects tend to concentrate on the epitaxial layer at the top of the protrusion. In the crystal layer, thus affecting the growth of the subsequent epitaxial layer

Method used

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  • Light-emitting diode and its manufacturing method
  • Light-emitting diode and its manufacturing method
  • Light-emitting diode and its manufacturing method

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Embodiment Construction

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] See figure 1 , first provide a sapphire substrate 110 . The surface of the sapphire substrate 110 has a plurality of protrusions 111 . In this embodiment, the cross section of the protruding portion 111 is semicircular. The cross section of the protruding portion 111 may also be triangular, trapezoidal or other polygonal.

[0031] See figure 2 , grow an undoped low-temperature GaN layer 120 with uniform thickness on the surface of the sapphire substrate 110 and the protruding portion 111 . In this embodiment, the thickness of the undoped low-temperature GaN layer 120 is 20-30 nm. The growth temperature of the undoped low temperature GaN layer 120 is 500-600°C. The purpose of growing the undoped low-temperature GaN layer is to grow the subsequent undoped high-temperature GaN layer 121 well.

[0032] see image 3 , growing an undoped high-temper...

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Abstract

A method for manufacturing a light-emitting diode, comprising the following steps: providing a sapphire substrate, a plurality of protrusions are formed on the surface of the sapphire substrate; growing an undoped low-temperature GaN layer with uniform thickness on the surface of the sapphire substrate and the protrusions; An undoped high-temperature GaN layer is grown on the undoped low-temperature GaN layer, and the undoped high-temperature GaN layer does not completely cover the undoped low-temperature GaN layer, exposing the undoped low-temperature GaN layer on the top of the protrusion ; attaching silica nanospheres on the undoped low temperature GaN layer on top of the exposed protrusions; attaching on the undoped high temperature GaN layer and on the undoped low temperature GaN layer on top of the protrusions The undoped high-temperature GaN layer continues to grow on the silicon dioxide nanosphere until it covers the silicon dioxide nanosphere; on the undoped high-temperature GaN layer, an N-type GaN layer, an active layer and a P-type GaN layer are sequentially grown.

Description

technical field [0001] The invention relates to a method for manufacturing a light-emitting diode, in particular to a method for manufacturing a light-emitting diode and a corresponding light-emitting diode that can effectively reduce crystal defects and improve light extraction efficiency of components. Background technique [0002] A light emitting diode (Light-emitting diode, LED) is an optoelectronic semiconductor element that converts electric current into a specific wavelength range. Light-emitting diodes have the advantages of high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life, so they can be widely used as light sources in the field of lighting. [0003] During the epitaxial growth process of light-emitting diodes, how to reduce crystal defects of light-emitting diodes is a problem that people need to consider. One approach to fabricate low-defect LEDs is to use patterned sapphire subs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/22
CPCH01L33/007H01L33/12H01L33/32
Inventor 邱镜学林雅雯凃博闵黄世晟
Owner ZHANJING TECH SHENZHEN
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