Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor wafer cooling apparatus

A cooling device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve the problems of semiconductor component life-span electrical characteristic deviation, temperature difference, etc., to suppress temperature difference, suppress temperature unevenness, close contact sex-enhancing effect

Inactive Publication Date: 2015-02-18
MITSUBISHI ELECTRIC CORP
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Due to such a temperature difference in the plane of the semiconductor wafer and between wafers, there is a problem that the lifetime of the semiconductor element produced by cutting out the semiconductor wafer and other electrical characteristics vary.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor wafer cooling apparatus
  • Semiconductor wafer cooling apparatus
  • Semiconductor wafer cooling apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] figure 1 is a block diagram of a semiconductor wafer cooling device according to Embodiment 1, figure 1 (a) is a floor plan, figure 1 (b) is figure 1 A-A section view in (a).

[0040] In the semiconductor wafer cooling device of the present embodiment, a plurality of semiconductor wafers 10 are placed on the tray 1 on the placement surface thereof. A cooling duct 2 is formed inside the tray 1 , and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing through the cooling duct 2 . For example, cooling duct 2 such as figure 1 As shown in (a), one cooling duct is arranged in a folded shape (serpentine arrangement) between both ends of the tray 1 .

[0041] Furthermore, a vacuum duct 3 is formed inside the tray 1 so as not to interfere with the cooling duct 2 , and an opening of the vacuum duct 3 is formed on the mounting surface of the tray 1 . The inside of the vacuum duct 3 is depressurized by a vacuum pump, and the semiconductor wa...

Embodiment approach 2

[0047] figure 2 It is a block diagram of the semiconductor wafer cooling apparatus of Embodiment 2. In the semiconductor wafer cooling device of the present embodiment, a plurality of semiconductor wafers 10 are placed on the loading surface of the tray 1 (see figure 1 ). A cooling duct 2 is formed inside the tray 1 , and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing through the cooling duct 2 . The cooling duct 2 is a single cooling duct arranged in a meandering manner (serpentine arrangement) between both ends of the tray 1 .

[0048] When one side of a square chip cut out from the semiconductor wafer 10 is defined as a (mm), and the side wall thickness of the cooling duct 2 is defined as b (mm), the distance between adjacent ducts of the cooling duct 2 ( Pipe interval) c (mm) satisfies:

[0049] [Formula 2]

[0050] c a 2 - 2 b . ...

Embodiment approach 3

[0056] image 3 , Figure 4 It is a block diagram of the semiconductor wafer cooling apparatus of Embodiment 3. In the semiconductor wafer cooling device of the present embodiment, a plurality of semiconductor wafers 10 are placed on the loading surface of the tray 1 (see figure 1 ). A pair of cooling ducts 2a, 2b are formed inside the tray 1, and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing in opposite directions through the cooling ducts 2a, 2b.

[0057] The cooling ducts 2a and 2b each have a structure in which a plurality of branch ducts are connected in parallel, and the branch ducts of the cooling duct 2a and the branch ducts of the cooling duct 2b are alternately arranged on a plane parallel to the mounting surface of the tray 1 .

[0058] Figure 4 (a) is the figure which looked at the cooling duct 2a, 2b from the back side of the tray 1 (the surface opposite to a mounting surface), Figure 4 (b) is from Figure 4 (a) A s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor wafer cooling apparatus which cools a semiconductor wafer that is an irradiated object while inhibiting temperature variation of the semiconductor wafer.SOLUTION: The semiconductor wafer cooling apparatus of the present invention comprises a tray 1 having a loading surface on which semiconductor wafers 10 are loaded, a cooling pipeline 2 in which flows coolant for cooling the semiconductor wafers 10 loaded on the loading surface, and a vacuum pipeline 3 having openings on the loading surface and provided in a tray 1 for absorbing the semiconductor wafers 10 loaded on the loading surface.

Description

[0001] This application is based on the divisional application of the Chinese application number 201110180911.3 application (semiconductor wafer cooling device) filed on June 30, 2011, the content of which is quoted below. technical field [0002] The present invention relates to a semiconductor wafer cooling device including a tray for placing and cooling a semiconductor wafer as an object to be irradiated when irradiating radiation. Background technique [0003] The time for electrons to recombine in a p-type semiconductor material or the time for holes to recombine in an n-type semiconductor material is called the minority carrier lifetime. In order to recombine more rapidly the remaining minority carriers after conduction, it is necessary to control the lifetime, and this lifetime control is performed by diffusing heavy metals such as gold and platinum or by irradiating charged particles such as electrons and protons. [0004] In order to prevent the temperature rise of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/673H01L21/687
CPCH01L21/67109H01L21/6838H01L21/683H01L21/02H01J37/20
Inventor 野口贵也
Owner MITSUBISHI ELECTRIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com