Through hole filling method during making of oxygen sensor

Abstract

The invention discloses a through hole filling method during making of an oxygen sensor, the upper surface of an air channel layer is printed with a metal layer, the position of the metal layer is corresponding to the position of inner electrode through holes of a functional layer; a white sheet layer is arranged just below a heating electrode layer, the upper surface of the white sheet layer are respectively printed with two metal layers, the two metal layers are corresponding to two heating electrode through holes of a heating electrode layer; after the functional layer, the heating electrode layer and the white sheet layer are respectively laminated, platinum paste is respectively filled into the inner electrode through holes and the heating electrode through holes by dispensing needles, under the effect of gravity, the platinum paste connects the metal layers with lead feet on the upper surface of the functional layer and the heating electrode layer, qualified rate of through hole filling is greatly improved, and the through hole filling method is simple and easy to operate.

Description

technical field [0001] The invention relates to the field of printing of casting ceramic substrates, in particular to a method for filling through holes in the process of manufacturing an oxygen sensor. Background technique [0002] The current chip oxygen sensor generally has a three-layer or four-layer structure, which belongs to the field of multi-layer co-fired ceramics. In order to achieve certain functions, it is necessary to print some metal patterns on each layer of substrates. On the surface of the layer structure, it is necessary to set some connection holes between the layers, and fill the holes with the metal paste of the printed electrodes after the lamination is completed, so as to connect the upper and lower electrodes, so as to lead the internal signal to the sensor surface For the lead part, this process is called via filling. [0003] In the manufacturing process, the commonly used method of filling via holes is to dry the electrodes 11 and lead wires afte...

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Problems solved by technology

[0004] Since the electrodes 11 and the leads are arranged on the upper and lower sides of the substrate 14, a problem that often occurs with the slurry filled in the via holes 12 by the above method is that the electrodes 11 cannot be effectively connected, and the leads are found after sintering. There is no connection with electrode 11, resulting in a substandard product that cannot be repaired, or the heating electrode is easy to burn out during use even if the connection is intact

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