Double-faced reflow soldering method for Roger substrate

Abstract

The invention relates to a double-faced reflow soldering method for a Roger substrate. The soldering method includes the steps that a cavity and the substrate are cleaned and dried; treated soldering paste is smeared on the substrate for printing; surface mounting is carried out by placing patches on the substrate smeared with the soldering paste; reflow soldering is carried out on the patches after the surface mounting is carried out. The double-faced reflow soldering method has the advantages that the soldering method is advanced and reasonable, double-faced printing of the substrate is finished by reasonably designing a silk-screen template, and double-faced high-quality soldering between the bottom layer of the substrate and the cavity as well as between the top layer of the substrate and a component is ensured by designing a corresponding load and determining a scheme for setting the temperature of a reflow brazier; according to the method, heat conductivity is high, efficiency is high, the soldering quality is reliable, and the method is easy to operate and low in cost and has high popularization value.

Description

technical field [0001] The invention relates to a Roger substrate double-sided reflow soldering method. Background technique [0002] Rogers RT / duroid 5880 substrates are more and more widely used in T / R components with various frequencies, powers and detection distances. Rogers RT / duroid 5880 substrate is a kind of flexible printed board material suitable for high-frequency millimeter wave field. The middle layer is polytetrafluoroethylene, with 18μm copper plating on both sides, and gold plating on the copper layer. The process flow of etching and electroplating, the entire thickness of the substrate is 0.254mm, see figure 1 and figure 2 . The substrate is thin, easily deformed and warped. [0003] At present, the domestic Rogers RT / duroid 5880 is generally bonded with the cavity and components with 84-1A conductive adhesive. This conductive adhesive not only fixes the substrate and the components on it, but also realizes electrical conduction. For the installation d...

AI Technical Summary

Problems solved by technology

[0004] Although bonding with conductive adhesive has its advantages of simple and flexible operation, unlimited operating space, and no high requirements for special equipment and special tools, it has high bonding strength and low resistivity, but the amount of glue dispensed is difficult. Control, poor thermal conductivity, and low efficiency are becoming more and more serious in the high-frequency millimeter wave field

[0005] First of all, the amount of glue dispensing is difficult to control, resulting in poor consistency of the thickness of the glue dispensing and the size of the glue dispensing shape, which makes the height and position of the bonded devices significantly different, so the arc length and arc height of the bonding gold wire vary greatly

These differences will not have a serious impact on the medium and low frequency circuits, but for the company's high frequency T / R components, it will obviously affect the frequency and power of the high frequency circuit, and sometimes even produce insurmountable noise

[0006] Secondly, due to the poor thermal conductivity of the conductive adhesive, it is difficult to conduct the heat generated by power devices such as frequency multipliers, amplifiers, mixers, and VCOs that make up the high-frequency T / R components, and the temperature of these devices continues to rise. , so that the operating point of the device will drift, the linear characteristics will deteriorate, and internal noise will be generated at the same time

[0007] In addition, the process of bonding with conductive adhesive is relatively complicated, and there are multiple drying and multiple placement processes

Low production efficiency, difficult to meet the needs of batch production

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