Anti-electrostatic heater plate structure

Abstract

The invention provides an anti-electrostatic heater plate structure applied to photoresist coating of flat-plate displays and developer tables. A glass substrate is arranged on the top surface of a heater plate and is heated up by the same. A plurality of jacking rods capable of jacking upwards from the top surface of the heater plate are mounted in the heater plate. A plurality of fixed jacking pins arranged at intervals are disposed on the top surface of the heater plate and used for supporting the glass substrate on the top surface of the heater plate. Compared with the conventional manner of directly attaching the glass substrate onto the surface of the heater plate, the manner of utilizing the jacking pins to jack the glass substrate by 0.1MM can not only eliminate electrostatic influences of the heater plate but eliminate influences to heat radiation conduction.

Description

technical field [0001] The invention relates to display screen manufacturing equipment, in particular to an antistatic hot plate structure capable of ensuring the reliability of OLEDs. Background technique [0002] Photoresist coating and developing equipment in flat panel display exposure process, such as Figures 1 to 3 As shown, the transfer of the glass substrate G is mainly carried out by the robot arm 8 . In the hot plate structure of the prior art, there is an electric heating device for heating the glass substrate G inside the hot plate 9 . Generally, a heating wire is arranged in the hot plate 9 through a hot groove. A plurality of liftable ejector pins 91 are arranged inside the hot plate 9 . The ejector pins 91 distributed around and in the center of the hot plate 9 are all adjusted to the same height, so that the glass substrate G is in the same horizontal position during the jacking process and after the jacking up to the specified height after the thermal pro...

AI Technical Summary

Problems solved by technology

The technical problem to be solved is that, if the electrostatic attraction force during the lift-off process is large enough, the excessive bowing of the substrate occurs before the substrate is completely detached from the substrate support

[0005] However, this prior art, such as Figure 5 As shown, the glass substrate 140 still deforms within 2mm of the height difference between the lifting pin 150 and the lifting pin 152, and the influence of static electricity has not yet been eliminated.

Therefore, this method will still cause fragments due to strong electrostatic adsorption

Also, because the top areas of the lift pins 150 and 152 are too large, it is easy to cause scratches on the glass substrate, resulting in fragments and appearance defects resulting in yield loss

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