Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment

A liquid cooling and equipment technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of inconvenient disassembly and installation

Active Publication Date: 2014-12-31
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a liquid cooling heat dissipation device and equipment to solve the problem of inconvenient disassembly and installation in the internal liquid cooling heat dissipation device

Method used

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  • Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment
  • Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment
  • Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Figure 2A It is an application schematic diagram of a liquid cooling heat dissipation device provided by Embodiment 1 of the present invention. The device provided by this embodiment is suitable for heat dissipation of memory. Such as Figure 2A As shown, the liquid cooling heat dissipation device 10 includes: a first heat sink 110, a second heat sink 111 ( Figure 2A not shown in ), clamp 120, water cooling head 130 and fixing parts of water cooling head 130; fixing parts of water cooling head 130 include fixing rod 150, buckle 160 and hook 101; , for placing in parallel on both sides of the memory 200 respectively, and contacting with both sides of the memory 200; clamp 140, for placing the first heat sink 110 and the second heat sink 111 placed on both sides of the memory 200 with the memory 200 Fixed; the water cooling head 130 is used to be fixed on the motherboard 100, and when the first heat sink 110 and the second heat sink 111 are respectively placed in par...

Embodiment 2

[0064] Figure 2A It can also be used as an application schematic diagram of a liquid cooling heat dissipation device provided in Embodiment 2 of the present invention, Figure 3A It is a top view of a heat sink in a liquid-cooled heat dissipation device provided in Embodiment 2 of the present invention, Figure 3B It is a side view of a heat sink in a liquid cooling heat dissipation device provided by Embodiment 2 of the present invention. In the liquid cooling heat dissipation device 10 provided in this embodiment, different from the above embodiments, the part of the second heat sink 111 extending from one end of the memory 200 is used for contacting the first heat sink 110 and the water cooling head 130 part of the top contact, the second cooling fin 111 is provided with a through hole extending from one end of the memory 200; 110 and the second heat sink 111 are inserted into the holes of the water cooling head 130 . It should be noted that, in this embodiment, the hoo...

Embodiment 3

[0068] Figure 4 It is an application schematic diagram of a liquid cooling heat dissipation device provided by Embodiment 3 of the present invention. On the basis of the liquid cooling heat dissipation device provided in the above embodiments, the liquid cooling heat dissipation device 10 provided in this embodiment, the fixing part of the water cooling head 130 also includes a support frame 170, and the support frame 170 is provided with holes. The hole is a through hole, and the hook 101 is arranged on the outer wall of the support frame 170; the support frame 170 is used to fix on the main board 100 and support the water cooling head 130, so that the water cooling head 130 is fixed on the main board 100 through the support frame 170 The other end of the fixing rod 150 is also used to pass through the through hole of the water cooling head 130 and insert into the hole of the support frame 170 .

[0069]In the liquid cooling heat dissipation device 10 provided in this embod...

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PUM

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Abstract

The embodiment of the invention provides a liquid cooling heat dissipation device and liquid cooling heat dissipation equipment. The liquid cooling heat dissipation device comprises two radiating fins, a fixture, a water-cooling head, a fixed link, a buckle and a hook, wherein the two radiating fins are respectively arranged on two sides of an internal storage in parallel; the water-cooling head is fixedly arranged on a main board and is in contact with the part, vertically extending out of one end of the internal storage, of one radiating fin; during installation, the other end of the fixed link passes through a through hole in one end of the buckle and a through hole of one radiating fin and is inserted into the hole of the water-cooling head, so that the buckle, one radiating fin and the water-cooling head are fixed together; the hook passes trough a through hole in the other end of the buckle and is buckled by the other end of the buckle. By virtue of a mounting tool with combined buckle and fixed link, the heat transfer distance of the liquid cooling heat dissipation device in installation and detachment processes are shortened without using tools, and the problem that detachment and installation in the liquid cooling heat dissipation device are inconvenient due to high thermal-conduction resistance of the internal storage liquid cooling heat dissipation device is solved.

Description

technical field [0001] Embodiments of the present invention relate to memory heat dissipation technology, and in particular to a memory liquid cooling heat dissipation device and equipment. Background technique [0002] With the increase of people's demand for computer performance, the speed of memory is also continuously improved, and the frequency and power consumption are also increased. Especially for the high frequency and high power consumption memory used in large-scale servers, higher requirements are put forward for its heat dissipation requirements and memory protection. [0003] For heat dissipation of high-speed and high-power memory, a liquid-cooled heat dissipation device with better heat dissipation effect is generally used. figure 1 It is a schematic diagram of the application of a common liquid cooling device for memory, such as figure 1 As shown, a heat sink is placed in parallel contact on both sides of the memory, and the two heat sinks and the memory a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 惠晓卫张军郭健
Owner HUAWEI TECH CO LTD
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