Electromechanical-thermal coupling design method of active phased array antenna cold plate based on device location

Abstract

The invention discloses an active phase-array antenna cooling plate electromechanical heat coupling design method based on the position of a component. The method includes the steps of determining a parameter of the heating component in an active phase-array antenna T / R assembly, designing the topology shape of a cooling plate flow channel and a geometrical model of an antenna cooling plate according to the position of the heating component, building a finite element model of an antenna, calculating array temperature field distribution of the antenna, calculating a phase error caused by structure deformation of the antenna and excitation current amplitude errors and phase errors caused by temperature changes, calculating electric performance of the active phase-array antenna, and determining a design scheme of the active phase-array antenna cooling plate according to gain index requirements. By means of the method, the active phase-array antenna cooling plate scheme based on the position of the component can be designed, heat generated by the heating component can be effectively dissipated, influences of the temperature changes on structure deformation and excitation current amplitude and phase can be analyzed in a quantitative mode, and the aims of improving temperature distribution and guaranteeing effective work are achieved on the premise that requirements of the electric performance and the structure mechanical performance of the antenna are met.

Description

technical field [0001] The invention relates to the technical field of radar antennas, in particular to an electromechanical thermal coupling design method for an active phased array antenna cold plate based on device positions, which can be used to guide the cold plate design, electromechanical thermal coupling performance analysis and evaluation of the active phased array antenna. Background technique [0002] With the demand for high gain, high power, and light weight of active phased array antennas, its heat flux continues to increase. Thousands of T / R components are densely covered on the array of active phased array antennas, the thermal power is very high, and the performance of T / R components is very sensitive to temperature. The unreasonable temperature distribution of the array will seriously affect the amplitude and phase control accuracy of the antenna array, and the temperature distribution will cause structural deformation, thereby changing the pattern of the a...

AI Technical Summary

Problems solved by technology

The existing cold plate runner topologies are all designed on the basis of a specific heat source arrangement or the assumption that the heat source position is evenly distributed and the heat generation is uniform. However, in the actual multi-chip component package, the T / R component The heating devices must be installed and distributed according to the requirements of the actual circuit design, which will lead to the variability and complexity of the arrangement of the heating devices, but the existing research is difficult to solve the heat dissipation problem of the active phased array antenna in this case

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