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Circuit board with high current module and manufacturing method thereof

A manufacturing method and high-current technology, which can be applied to printed circuits connected to non-printed electrical components and assembling printed circuits with electrical components, etc. and the effect of the broken drill bit

Active Publication Date: 2017-10-17
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Circuit boards with high-current modules are used as automotive electronic components, especially in high-power and high-voltage parts such as engine power supply parts and automotive central electrical power supply parts. The circuit boards are required to have good heat aging resistance and high and low temperature cycle reliability. characteristics, but currently the existing high-current module 1 and circuit board 3 are combined by means of surface welding, bonding sheet 2, etc., such as figure 1 As shown, it not only takes up space, but also has quality and reliability safety hazards in welding

Method used

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  • Circuit board with high current module and manufacturing method thereof
  • Circuit board with high current module and manufacturing method thereof
  • Circuit board with high current module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] A method for making a circuit board with a large current module, such as figure 2 shown, including the following steps:

[0086] 1) Inner layer and prepreg gong board and fusion: first pre-stretch the inner layer and prepreg according to 0.3 mil / inch (mil / inch) in the radial direction and 0.5 mil / inch (mil / inch) in the weft direction, and perform gong board, and then according to the conventional process, the prepreg (5 pieces of prepreg of model 7628) and the inner layer (2 pieces of inner layer with a thickness of 21mil) are fused and combined, fixed with rivets, and then according to the predetermined design graphics. The embedding space of the copper block is provided on the layer and the prepreg. Among them, 1mil is 25.4μm.

[0087] 2) Embedding of high-current modules: First, the corners of the copper block 1 are rounded and chamfered, and then browned. The browning parameters are: sodium hypochlorite concentration 4.2%, hydrogen peroxide concentration 4%, temp...

Embodiment 2

[0098] The manufacturing method of the circuit board with a large current module in this embodiment is basically the same as that in Embodiment 1, except that:

[0099] 1) Inner layer and prepreg gong board and fusion: first, the inner layer and prepreg are pre-stretched according to 0.2 mil / inch (mil / inch) in the radial direction and 0.4 mil / inch (mil / inch) in the weft direction.

[0100]2) Embedding of large current modules: Browning treatment parameters are: sodium hypochlorite concentration 3.8%, hydrogen peroxide concentration 3.3%, temperature 32°C and etching rate 1.25μm / cm 2 . When carrying out the embedding copper block pressing step, the pressing temperature and pressing plate pressure are carried out according to the parameters in Table 3 below.

[0101] Table 3. Lamination parameters of embedded copper block

[0102]

[0103]

[0104] At the beginning, the system was evacuated for 5 minutes to make the vacuum degree less than 20mbar. After maintaining for 1...

Embodiment 3

[0110] The manufacturing method of the circuit board with a large current module in this embodiment is basically the same as that in Embodiment 1, except that:

[0111] 1) Inner layer and prepreg gong board and fusion: first, the inner layer and prepreg are pre-stretched according to 0.4 mil / inch (mil / inch) in the radial direction and 0.6 mil / inch (mil / inch) in the weft direction.

[0112] 2) Embedding of high-current modules: Browning treatment parameters are: sodium hypochlorite concentration 4.6%, hydrogen peroxide concentration 5%, temperature 38°C and etching rate 1.75μm / cm 2 . When carrying out the embedding copper block pressing step, the pressing temperature and pressing plate pressure are carried out according to the parameters in Table 5 below.

[0113] Table 5. Embedded copper block pressing parameters

[0114]

[0115] At the beginning, the system was evacuated for 5 minutes to make the vacuum degree less than 20mbar. After maintaining for 100 minutes, the vac...

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Abstract

The invention discloses a circuit board with a large current module and a manufacturing method thereof, belonging to the technical field of circuit board manufacturing. The manufacturing method comprises the following steps: 1) fusion of inner layer and prepreg gong board; 2) embedding of high current module; 3) drilling; 4) sinking copper; solder layer; surface treatment. The circuit board with high-current modules prepared by the manufacturing method has the advantages of saving system integration costs, improving reliability, increasing capacitance, reducing impedance, reducing wiring errors, reducing self-inductance coefficient, improving thermal performance, saving space, and the like. It provides strong support for electronic components for the accelerated marketization of electric vehicles and hybrid vehicles.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board with a large current module and a production method thereof. Background technique [0002] With the improvement of people's living standards, the requirements for the environment are getting higher and higher, the awareness of energy conservation and the sense of energy crisis are getting stronger and stronger, and the voice of accelerating the research and development of hybrid electric vehicles is getting louder and louder. At the same time, the cost performance and marketization degree of hybrid electric vehicles are more and more widely concerned by people. Furthermore, in order to meet the needs of hybrid electric vehicles, electronic technology is also constantly developing and innovating electronic components for high-end hybrid electric vehicles, and boosting the acceleration of hybrid electric vehicles towards marketization. With the dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K1/18
Inventor 谭健文
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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