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Substrate processing control equipment and control method

A technology for controlling equipment and substrate processing, which is applied in the fields of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., and can solve the problems of long waiting time and low work efficiency of substrate groups

Inactive Publication Date: 2014-11-19
熊丹
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the waiting time of the substrate group is extremely long, and the work efficiency is extremely low, which is far from meeting the needs of the market.

Method used

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  • Substrate processing control equipment and control method
  • Substrate processing control equipment and control method
  • Substrate processing control equipment and control method

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no. 1 example

[0035] Please refer to image 3 , the first embodiment of the control method for substrate processing of the present invention includes:

[0036] Step 1 S1: Each heating device 110 of the processing device 10 regularly receives the substrate group 20 to be heated from the first conveying mechanism 12 and heats the substrate group 20 to be heated;

[0037] Step 2 S2: When the substrate group 20 reaches the heating cycle, the processing device 10 moves the heating device 110 corresponding to the substrate group 20 to the position of the second conveying mechanism 14, and the substrate group 20 that reaches the heating cycle Transfer to the next platform by the second transfer mechanism 14 and make the heating device 110 into an empty state;

[0038] Step 3 S3: The heating device 110 in an empty state receives and heats the substrate group 20 to be heated transported from the first transport mechanism 12 again.

[0039]The substrate processing control method of the present inve...

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Abstract

The invention discloses substrate processing control equipment, which comprises a processing device and a first transmission mechanism and a second transmission mechanism respectively connected with the processing device. The first transmission mechanism is used for transmitting a to-be-heated substrate group to the processing device; the processing device comprises a plurality of heating devices, each heating device is used for receiving the to-be-heated substrate group regularly and carrying out heating, the processing device moves the heating device corresponding to the substrate group reaching the heating cycle to the position of the second transmission mechanism, and the heating device in an empty-loading state receives the next to-be-heated substrate group and carries out heating; and the second transmission mechanism is used for transmitting the substrate group reaching the heating cycle to a next platform. According to the method, multiple to-be-heated substrate groups can be heated at the same time in one heating cycle, the heating cycle of each substrate is greatly shortened, and the working efficiency is greatly improved. The invention also discloses a substrate processing control method.

Description

technical field [0001] The invention relates to a control device and a control method for substrate processing, and more particularly to a control device and a control method for heating a solar cell glass substrate before coating and cooling after coating. Background technique [0002] As people's demand for energy increases day by day, solar cells, as an emerging environmental resource, are being used more and more widely. Correspondingly, the solar cell manufacturing industry is constantly growing because of its broad application prospects. [0003] In the manufacturing process of solar cells, plasma chemical vapor deposition (PECVD) of solar cell glass substrates is a key process. Before the coating is deposited, the substrate must be heated, and after the coating is deposited, the substrate must be cooled to meet the manufacturing requirements. Traditionally, a transmission mechanism transports the substrate group to be heated to an independent heating device. After t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L31/18
CPCH01L21/67276H01L31/18Y02P70/50
Inventor 熊丹
Owner 熊丹
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