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Printed circuit board chemical copper plating activation solution

A printed circuit board, chemical copper plating technology, applied in liquid chemical plating, metal material coating process, coating, etc. High stability, reducing environmental pollution, low hydrochloric acid content

Active Publication Date: 2014-11-19
珠海伟之华新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The hydrochloric acid-based activation solution requires a large amount of hydrochloric acid during the preparation process. The operating environment is harsh, and there are environmental protection problems, and its stability is also affected. The resin has a certain erosion effect, resulting in a decrease in the bonding force of the matrix material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] A printed circuit board electroless copper plating activation solution comprises the following raw materials in parts by mass: 2000 grams of stannous chloride dihydrate, 40 grams of palladium chloride, 1600 grams of sodium chloride, 50 grams of sodium stannate trihydrate, 250 grams of urea, 10 grams of 4-hydroxy-3-methoxybenzaldehyde, 5500 grams of deionized water;

[0011] Its preparation method is: add the sodium chloride that mass parts are 1600 grams and the distilled water that mass parts are 5500 grams in the container with agitator, start stirring, after sodium chloride dissolves completely, stop stirring, make the Sodium solution; get 710 grams of sodium chloride solution made, add the palladium chloride that mass portion is 40 grams, stir until palladium chloride dissolves completely, make A liquid; Tin is added in the remaining 6390 grams of sodium chloride solution of making, then add the 4-hydroxyl-3-methoxybenzaldehyde that mass portion is 10 grams, stir un...

Embodiment 2

[0013] A printed circuit board electroless copper plating activation solution comprises the following raw materials in parts by mass: 1000 grams of stannous chloride dihydrate, 20 grams of palladium chloride, 1500 grams of sodium chloride, 40 grams of sodium stannate trihydrate, and 300 grams of thiourea , 5 grams of 4-methoxy salicylaldehyde, 5000 grams of deionized water;

[0014] The preparation method is: add 1500 grams of sodium chloride and 5000 grams of distilled water into a container with a stirrer, start stirring, and stop stirring after the sodium chloride is completely dissolved to prepare Sodium solution; get 650 grams of sodium chloride solution made, add the palladium chloride that mass part is 20 grams, stir until palladium chloride dissolves completely, make A liquid; Tin joins in the remaining 5850 grams of sodium chloride solutions that make, then add mass portion and be 5 grams of 4-methoxy salicylaldehyde, stir until tin protochloride dihydrate dissolves c...

Embodiment 3

[0016] A printed circuit board electroless copper plating activation solution comprises the following raw materials in parts by mass: 3000 grams of stannous chloride dihydrate, 60 grams of palladium chloride, 1800 grams of sodium chloride, 80 grams of sodium stannate trihydrate, 200 grams of urea, 20 grams of 3,5-dimethoxy-4-hydroxybenzaldehyde, 6000 grams of deionized water;

[0017] The preparation method is as follows: add 1800 grams of sodium chloride and 6000 grams of distilled water into a container with a stirrer, start stirring, and stop stirring after the sodium chloride is completely dissolved to prepare Sodium solution; get 10% of the sodium chloride solution quality that makes, add the palladium chloride that mass part is 60 grams, stir until palladium chloride dissolves completely, make A liquid; Add stannous chloride in the remaining sodium chloride solution of making, then add mass portion and be 20 grams of 3,5-dimethoxyl-4-hydroxybenzaldehyde, stir until stann...

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PUM

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Abstract

The invention discloses a printed circuit board chemical copper plating activation solution. The printed circuit board chemical copper plating activation solution comprises the following raw materials in parts by mass: 100-300 parts of stannous chloride dihydrate, 2-6 parts of palladium chloride, 150-180 parts of sodium chloride, 4-8 parts of sodium stannate trihydrate, 20-30 parts of additives, 0.5-2 parts of a reducing agent and 500-600 parts of deionized water. By adopting a sodium chloride solution, palladium chloride is prepared into liquid A, and stannous chloride dihydrate and the reducing agent are prepared into liquid B; under an ultrasonic action, the liquid A is dispersed into the liquid B, and sodium stannate trihydrate, the additives and the reducing agent are assisted as auxiliary stabilizing agents to prepare the chemical copper plating activation solution. The chemical copper plating activation solution disclosed by the invention is used for activating a printed circuit board before chemical copper plating, can achieve the effects of activating the non-conductor surface of the printed circuit board and performing hole activation on the printed circuit board, and has the advantages of achieving low hydrochloric acid content and high stability, saving the raw materials and reducing the environmental pollution without damaging a substrate of the printed circuit board.

Description

technical field [0001] The invention relates to the technical field of electroless copper plating, in particular to an activation solution for electroless copper plating of printed circuit boards. Background technique [0002] Electroless copper plating is widely used in the electronics industry. After electroless copper plating is used to make the activated non-conductor surface conductive, double-sided or multi-sided printed circuit boards with through holes can be manufactured. Printed circuit boards are "the mother of electronic system products". Thickened copper layer is electroplated on the basis of electroless copper plating to ensure its solderability, protection, conductivity, and wear resistance. Before electroless copper plating on printed circuit boards, the substrate needs to be activated. Uniform activation of the surface is a prerequisite for uniform electroless copper plating and uniform electroplating. Electroless copper plating is a key process, and activat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30C23C18/38
Inventor 修建东刘方旭
Owner 珠海伟之华新材料有限公司
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