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Phenol aldehyde molding compound for commutators

A technology of phenolic molding compound and commutator, which is applied in the field of composite materials to achieve the effects of improving heat resistance, strong bonding ability and good toughness

Active Publication Date: 2014-10-08
上海欧亚合成材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a high-performance, easy-to-process, low-cost phenolic molding compound that can be used for commutators in line with the concept of environmental protection in view of the problems existing in the existing phenolic molding compound

Method used

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  • Phenol aldehyde molding compound for commutators
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  • Phenol aldehyde molding compound for commutators

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Embodiment Construction

[0038] The manufacturing method of the molding material of the present invention can adopt the traditional mixing method, and can also adopt the single-screw extrusion method.

[0039]Before kneading or extrusion, pre-mix urethane, inorganic filler (except glass fiber), phenolic resin, melamine resin and curing accelerator, pigment and release agent in a high-speed mixer for 2-6 Minutes, then mix the above mixture with glass fiber in proportion, heat and knead or extrude, and finally granulate to obtain the desired product.

[0040] Below just illustrate the present invention:

[0041] The formulation materials shown in Table 1 are mixed and kneaded or extruded according to the aforementioned manufacturing method, and finally granulated to obtain the desired product. Implementations 1-9 formulations and property data are listed in this table. The dosages of the formulations in the table are expressed in % by weight. The sample pieces for characteristic evaluation were prepa...

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Abstract

The invention discloses a phenol aldehyde molding compound for commutators, which is composed of a solid thermoplastic phenol aldehyde resin, a solid cardanol modified thermosetting phenol aldehyde resin, a solid melamine resin, a crystal whisker reinforcing material, a glass fiber reinforcing material, a mineral filler, a urotropine curing agent, a curing accelerator and a releasing agent. The material has higher toughness and higher dimensional stability under damp conditions. According to the phenol aldehyde molding compound, the cardanol modified thermosetting phenol aldehyde resin, thermoplastic phenol aldehyde resin and solid melamine resin are used as the adhesives, the crystal whisker and glass fiber are used as the reinforcing materials, the mineral is used as the filler, the urotropine is used as the curing agent, and the curing accelerator is also used, thereby ensuring the performance requirements of the material.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a phenolic molding compound used for a commutator. technical background [0002] The commutator is an integral part of the motor. Commutators with heat resistance are usually composed of copper commutator segments (commutator segments) and thermosetting plastics represented by phenolic plastics as insulators. The basic requirements for materials used in commutators should have heat resistance, high mechanical strength and dimensional stability against moisture. For those commutators used in small motors, since the shaft slightly thicker than its inner diameter is usually directly pressed into the inner diameter of the commutator made of phenolic molding compound, the commutator is required to have no This toughness advantage of being split. [0003] In order to meet the above performance requirements, the usual practice is to use phenolic resin as a binder, glass f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L61/14C08L61/28C08L45/02C08K13/04C08K7/14C08K7/04C08K7/18C08K3/04C08K5/098C08K5/10
Inventor 杨小云沐霖朱永茂
Owner 上海欧亚合成材料股份有限公司
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