A copper ion concentration automatic balance control device and control method thereof

Abstract

The present invention involves an automatic balance control device and its control method for a copper ion concentration, which is used for self -regulating balance of copper ion concentration during the production process of electroplating copper bag aluminum wires.Including at least one electroplating groove and a specific slot, an exchange slot, the sequence of connection sequence is a specific slot connecting the electroplating groove through the pipeline. The electroplating groove is connected to the buffer slot through the pipeline. The buffer slot is connected to the specific slot through the pipeThere is also an automatic pump on the pipeline between the buffer groove. There is a CU2+online monitor connected to the buffer groove. A PLC controller is connected to the CU2+online monitor.The concentration controls the high -frequency power output variable voltage by the central control module, that is, control the working current in a specific slot, and achieve the adjustable control of the CU2+concentration change rate in a specific groove, so that the copper ion concentration in the electroplating groove is maintained for a long time onIn terms of the stability required by the process, the slot solution is not required to be diluted and maintained on a regular basis, and the waste liquid is not generated.

Description

technical field [0001] The invention relates to a copper ion concentration automatic balance control device and a control method thereof, which are used for self-adjustment and balance of copper ion concentration in the production process of electroplating copper-clad aluminum wire rods. Background technique [0002] The copper-clad aluminum structure is a bimetallic composite wire formed by concentrically laminating a layer of copper on an aluminum rod. This composite material combines the functional advantages of aluminum's high-quality electrical conductivity, low cost, and copper's low contact resistance and high chemical stability. and the "third conductor material" after aluminum. The most commonly used copper-clad aluminum preparations are clad welding and electroplating methods, among which the electroplating method has the advantages of being able to produce products with various copper content ratios and low production costs. However, the rinsing water of the ele...

AI Technical Summary

Problems solved by technology

The method of dilution and addition has the following disadvantages: 1. Because of the copper sulfate solution that is diluted, it takes a higher cost to do secondary treatment as refining copper sulfate, and the sulfuric acid in the solution has no way to extract and cause waste. Post-discharge requires cost and will also cause environmental pollution

2. Manual adjustment can only work intermittently, that is, once a period of time, which will also make the bath solution not work at the optimal concentration for a long time. Although it can also be produced, it will have an impact on product quality

3. If the copper sulfate content of the concentration is close to 220 g / L for a long time, the acid consumption will increase by 5-10 times compared with normal conditions, and the cost will increase

Copper sulfate will also have grains precipitated due to the close to saturation state, and the precipitated grains will form a film on the anode copper plate, which will affect the conductive area of ​​the anode, increase power consumption and affect product quality

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