High-density stackable packaging structure and manufacturing method

Abstract

The invention relates to a novel high-density stackable packaging structure and a manufacturing method thereof. The packaging structure comprises a metal lead frame and a substrate (5). A chip (3) is stuck to the front face of the metal lead frame or the substrate (5). Copper columns (2) are arranged on the periphery of the chip (3), tin columns (4) are arranged on the tops of the copper columns (2), the peripheries of the copper columns (2), the chip (3) and the tin columns (4) are coated with molding compounds (1) which are higher than the tin columns (4), and installation holes (6) are formed in the tops of the tin columns (4). The novel light-density stackable packaging structure and the manufacturing method of the novel high-density stackable packaging structure have the advantages that substrate design and manufacturing precision is improved in an electroplating and laser drilling combined mode, fine pitch packaging body stacking can be achieved, and packaging body safety and reliability are improved.

Description

technical field [0001] The invention relates to a high-density stackable packaging structure and a manufacturing method, belonging to the technical field of semiconductor packaging. Background technique [0002] The current PoP encapsulation form is as follows: Figure 12 As shown, the manufacturing process is mainly to stack the top-layer substrate package on the bottom logic substrate, and use the metal copper pillars on the bottom substrate to realize the stacking and electrical interconnection of the two packages through the mounting and reflow soldering of solder balls. [0003] The above PoP (Package on Package) packaging structure has the following disadvantages: [0004] 1. The electrical connection copper pillars on the bottom substrate are limited by height and diameter in terms of electroplating manufacturing process, so high-density design and manufacture cannot be achieved; [0005] 2. The bottom package and the top package are interconnected through the metal ...

AI Technical Summary

Problems solved by technology

[0004] 1. The electrical connection copper pillars on the bottom substrate are limited by height and diameter in terms of electroplating manufacturing process, so high-density design and manufacture cannot be achieved;

[0005] 2. The bottom package and the top package are interconnected through the metal solder balls on the outer legs of the top package. After reflow soldering, the metal solder balls will be thermally deformed, and the distance between the solder balls of the top package will be smaller than before reflow soldering. The short circuit, so the package stack with the top package as Fine Pitch (fine pitch) cannot be used;

[0006] 3. If the substrate package is stacked to reduce the ball pitch by stacking multiple small metal tin balls for interconnection, it will be difficult to align during the mounting and stacking process, which will easily cause accuracy deviation or the upper ball will slip, resulting in an open circuit or short circuit affecting the placement. Yield

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