Preparation method for printed circuit board

Abstract

The invention discloses a preparation method for a printed circuit board. The method comprises the steps of: plating a matte copper or bright copper layer on the copper layer of a graphic line; and plating a nickel sulfate layer or nickel aminosulfonate layer on the matter or bright copper layer of the graphic line. The plating of the matte copper or bright copper layer on the copper layer of the graphic line includes: a. conducting treatment by a 8-10% acidic degreasing agent at room temperature for 5-7min, and carrying out two-stage overflow washing; b. performing micro-etching treatment by 80-100g / L ammonium persulfate or sodium persulfate and 3-5%sulfuric acid at room temperature for 40s, and carrying out two-stage overflow washing. Compared with other making processes, the preparation method for the printed circuit board provided by the invention has a shortest technological process and a minimum wastewater discharge amount. In short, no matter from the aspect of making cost or the aspect of quality, the method provided by the invention is a good choice and has sound advantages.

Description

technical field [0001] The invention belongs to a method for preparing a printed circuit board. Background technique [0002] At present, in the printed circuit board (PCB board) manufacturing industry, with: a, market price competition intensifies. b. Staff salary increases. c. The price of the main material gold salt has risen (the leading products are battery nickel gold plate, gold finger nickel gold plate and thick gold plate account for about 95% of the total output) d. The original production process itself has a high consumption of gold salt (this process is the last one) The process in the 1980s-just like circuit graphics electro-nickel electro-gold→wet film printing sealing oil→electro-gold finger gold→alkaline etching→solder mask, character production→gold finger protection, electro-gold time in this production process , the line under the solder mask and the process side of the via wall, the four sides and the cross-section of the workpiece are uniformly electr...

AI Technical Summary

Problems solved by technology

[0004] The commonality of battery nickel gold plate, gold finger nickel gold plate and nickel thick gold plate is: one side is exposed several gold fingers (customers use for electrical contact) and test point PAD, the rest area is covered by solder mask characters, while the other side is exposed The PAD is used to paste components (first brush the solder paste on the PAD to paste the components, and then play the nickel sheet or nickel strip after SMT. Generally, the assembly is completed in two welding forms, and the rest of the area is covered with solder mask. As a result, the production cost of the product is higher

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