Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Modularized LED lamp strip and processing method thereof

A technology for LED strips and LED chips, which is applied in lighting and heating equipment, lighting devices, electrical components, etc., can solve the problems of increasing the thickness of LEDs, increasing the difficulty of processing, and increasing the difficulty of processing, so as to reduce production costs and processing efficiency. High, application-perfect effects

Inactive Publication Date: 2014-08-20
吴锦星 +1
View PDF12 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of PCB circuit board patch LED also has complex processing technology, which leads to high processing difficulty and low efficiency. Because it needs to be applied to PCB circuit boards, it not only increases the thickness of the LED, but also increases the production cost. In addition, the external power supply connected to the input terminal of the rectifier The wire must pass through the entire lamp bracket to realize the power supply, especially for the strip-shaped LED fluorescent lamp, which undoubtedly increases the difficulty of processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modularized LED lamp strip and processing method thereof
  • Modularized LED lamp strip and processing method thereof
  • Modularized LED lamp strip and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] refer to Figure 1 to Figure 6 The present invention provides a modular patch LED light bar, the positive metal wire 3 and the negative metal wire 4 are correspondingly connected to the input terminal of the rectifier, one end of the positive metal baseline 1 and the negative metal baseline 2 are connected to the electrodes of the LED chip, and the other One end is connected to the output terminal electrode of the rectifier. The positive metal base wire 1, the negative metal base wire 2, the positive metal wire 3, and the negative metal wire 4 are thin flat metal wires such as iron, copper, aluminum, etc. In order to ensure that these thin metal wires have good conductivity and are not corroded, the These iron, copper and aluminum thin metal wires are electroplated with a layer of anti-corrosion conductive layer. In addition,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a modularized LED lamp strip and a manufacturing method thereof. The LED lamp strip comprises a positive pole metal wire and a negative pole metal wire, wherein the positive pole metal wire and the negative pole metal wire are connected with the input end of a rectifier. The LED lamp strip further comprises a positive pole metal base line and a negative pole metal base line, wherein the positive pole metal base line and the negative pole metal base line are connected with an LED chip and the output end of the rectifier, the positive pole metal wire, the negative pole metal wire, the positive pole metal base line and the negative pole metal base line are distributed in parallel, multiple plastic bases transversely wrapping the positive pole metal wire, the negative pole metal wire, the positive pole metal base line and the negative pole metal base line are arranged, the upper portions of the plastic bases are provided with a containing groove used for containing the LED chip, the bottom of the containing groove is exposed so that the positive pole metal base line and the negative pole metal base line of an electrode of the LED chip can be welded, and a light-pervious layer is further encapsulated on the surface, in the containing groove, of the LED chip. By means of the technical scheme, the height of an LED lamp can be effectively reduced, processing is easier, processing efficiency is higher, production cost is effectively lowered, troubles of externally connecting a power supply line are omitted, and application approximates to perfectness.

Description

technical field [0001] The invention relates to the technical field of LED packaging, refers to patch LEDs, and in particular to a modular patch LED light bar structure. Background technique [0002] The existing SMD LEDs are mainly pasted on the surface of the PCB circuit board to achieve light emission, which is suitable for SMT processing and reflow soldering. This method of SMD LEDs solves the problems of brightness, viewing angle, flatness, reliability, The problem of consistency, compared with other forms of LED packaging devices, it has the advantages of strong vibration resistance, low solder joint defects, good high-frequency characteristics, etc., and can package multiple LED chips in a small area. Compared with the LED packaged on the surface of the PCB circuit board, it can reduce the size and weight of electronic products, and finally make the application more perfect. However, this kind of PCB circuit board patch LED also has complex processing technology, whi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F21S4/00H01L33/54H01L33/00
Inventor 吴锦星朱亦武
Owner 吴锦星
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com