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Manufacturing method for ball grid array (BGA) of super-thick copper circuit board

A manufacturing method and circuit board technology, applied in the direction of forming the electrical connection of printed components, etc., can solve the problems of easy-to-break drill bits, too thick total copper thickness, small hole diameter of drilling holes, etc., so as to avoid easy-to-break drill bits and solve drilling processing problems. Effect

Active Publication Date: 2014-08-06
SHENNAN CIRCUITS
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AI Technical Summary

Problems solved by technology

[0002] At present, for multi-layer ultra-thick copper foil printed circuit boards (Printed Circuit Board, PCB) with each layer of copper thickness ≥ 10 ounces (OZ, thickness unit), generally do not involve the production of BGA (Ball Grid Array, ball grid array PCB) ), this is because the total copper thickness of each layer of this type of circuit board is too thick, and the drill hole diameter in the BGA area is small, which makes it easy to break the drill bit during processing

Method used

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  • Manufacturing method for ball grid array (BGA) of super-thick copper circuit board
  • Manufacturing method for ball grid array (BGA) of super-thick copper circuit board
  • Manufacturing method for ball grid array (BGA) of super-thick copper circuit board

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Embodiment Construction

[0009] The embodiment of the present invention provides a method for manufacturing an ultra-thick copper circuit board BGA, adopting the design idea of ​​local copper reduction, which can avoid drill breakage and solve the problem of drilling processing for ultra-thick copper circuit board BGA in the prior art. A detailed description will be given below in conjunction with the accompanying drawings.

[0010] Please refer to figure 1 , the embodiment of the present invention provides a method for manufacturing an ultra-thick copper circuit board BGA, comprising:

[0011] 110. A BGA etching step for thinning the copper foil in the BGA area on the inner layer copper clad board to 2-5 ounces.

[0012] Generally, the copper thickness of each layer of the so-called ultra-thick copper circuit board BGA is ≥ 10 ounces. In the PCB manufacturing process of this embodiment, before the lamination step, the inner copper clad laminate is firstly processed, and the copper foil in the BGA a...

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Abstract

The invention discloses a manufacturing method for a ball grid array (BGA) of a super-thick copper circuit board. The method comprises the steps of thinning copper foil of the BGA area on an inner-layer copper-clad plate to 2-5 ounces in an etching mode, and forming a through hole in the BGA area by adopting the power drill process. According to the technical scheme, the design idea of reducing copper partially is adopted, drilling is carried out after the copper foil of the BGA area is thinned in the etching mode, and therefore the technical problem that a drill is easy to break due to excessively large thickness of the copper foil can be solved, and the drilling problem of the BGA of the super-thick copper circuit board in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing an ultra-thick copper power board BGA. Background technique [0002] At present, for multi-layer ultra-thick copper foil printed circuit boards (Printed Circuit Board, PCB) with each layer of copper thickness ≥ 10 ounces (OZ, thickness unit), generally do not involve the production of BGA (Ball Grid Array, ball grid array structure PCB) ), this is because the total copper thickness of each layer of this type of circuit board is too thick, and the drill hole diameter in the BGA area is small, which makes it easy to break the drill bit during processing. Contents of the invention [0003] In view of this, an embodiment of the present invention provides a method for manufacturing an ultra-thick copper circuit board BGA to solve the problem of drilling holes for the ultra-thick copper circuit board BGA in the prior art. [0004] For this reason, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
Inventor 刘宝林郭长峰缪桦
Owner SHENNAN CIRCUITS
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