Composite sieve plate hole processing multi-spindle CNC drilling and milling platform

Abstract

The invention discloses a composite type sieve plate hole processing multi-spindle numerical control drilling and milling platform, comprising a main beam, a longitudinal beam, a workbench, a vertical drilling spindle moving workbench, a horizontal milling spindle moving workbench, a longitudinal beam moving drive device, a vertical Drilling spindle moving table lifting drive device, horizontal milling spindle moving table lifting drive device, electric spindle lifting drive device, in which the connecting frame is installed between the two longitudinal beams, the longitudinal beam moving driving device is installed on the main beam, and the vertical drilling spindle The lifting drive device of the mobile worktable and the lifting drive device of the movable worktable of the horizontal milling spindle are respectively installed at both ends of the longitudinal beam, and the lifting drive device of the electric spindle is installed on the movable workbench of the vertical drilling spindle. The invention provides a multi-spindle numerical control drilling and milling platform which is applied to machine tools to realize high-efficiency, high-quality, and low-cost composite sieve plate hole processing.

Description

technical field [0001] The invention relates to a composite multi-spindle numerical control drilling and milling platform for processing sieve plate holes, which belongs to the field of mechanical technology. Background technique [0002] In papermaking, mining, storage, food, chemical and other industries, various screening, sieving and pressure extrusion equipment have been widely used, and the key components of this type of equipment are the sieve plate or sieve cylinder, which has a huge market capacity . However, for sieve plates with a thinner thickness and a ratio of sieve hole diameter to sieve plate thickness greater than or equal to 1, CNC punching or laser processing machines are generally used for processing, which have high processing efficiency and quality, and the processing cost is relatively low. However, when the thickness of the sieve plate is thick or the ratio of the diameter of the sieve hole to the thickness of the sieve plate is less than 1, it is mo...

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Problems solved by technology

However, when the thickness of the sieve plate is thick or the ratio of the diameter of the sieve hole to the thickness of the sieve plate is less than 1, it is more difficult to use stamping or laser processing. For this type of sieve plate, drilling is generally used for processing

However, in the existing technology, most of the traditional CNC drilling and milling machines have only one or two spindles, and the processing efficiency is low when performing sieve holes, and more resources are needed to process repetitive sieve holes, especially for some The processing of compound hole sieve plate is currently difficult to achieve high efficiency, high quality and low cost processing with ordinary CNC drilling and milling machines or manual methods. Machine sieve processing

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