evaporative radiator

Abstract

The invention discloses an evaporative heat radiator which comprises a machine case shell. A metal heat radiator body is arranged above one side in the machine case shell, and comprises a metal heat radiator base, and a plurality of heat radiation columns are distributed on the metal heat radiator base. A heating electronic element is pasted on the outer side of the metal heat radiator base, hydrophilic material layers are arranged on the surfaces of the heat radiation columns, the metal heat radiator body is of a semi-sealed structure, a top cover and an air inlet filter screen are arranged at the top of the metal heat radiator body, an exhaust pipe is connected with the bottom end of the metal heat radiator body, an exhaust opening is formed in the lower portion of the machine case shell on the opposite side of the metal heat radiator body, an exhaust fan is arranged at the exhaust opening, a water tank is arranged on the outer side face of the machine case shell below the exhaust opening, the exhaust pipe comprises two branch pipes, one branch pipe is connected to the exhaust opening, the other branch pipe is a condensate water backflow channel, and the condensate water backflow channel is connected to the upper portion of the water tank. Heat energy generated by the heating electronic element is communicated with the exhaust pipe through the heat radiation columns. A capillary water supply channel with hydrophilic materials is arranged in the machine case shell, the upper section of the capillary water supply channel is connected to the heat radiation columns, and the bottom end of the capillary water supply channel is connected with the water tank. The simplified evaporation heat radiation technology and the simplified capillary water supply technology are introduced in, and a direction is indicated for the development of the heat radiation field.

Description

technical field [0001] The invention relates to a cooling device, in particular to a high-efficiency cooling device for heating elements such as a computer central processing unit (CPU) and a display chip. Background technique [0002] In the existing heat dissipation technology, the ordinary radiator has a simple structure, but it only relies on heat conduction to dissipate heat, and the effect is not good; the water cooling system has a good heat dissipation effect but has a complex structure, high cost, high failure rate, and water leakage can easily cause short circuits; the existing water cooling system It needs to drive water circulation to dissipate heat, which consumes a lot of power; ordinary radiators rely on fans to accelerate heat conduction and heat dissipation, and it is easy to block the heat dissipation channels due to dust entering, which reduces the heat dissipation effect, so the fans also consume a lot of power. Contents of the invention [0003] The ob...

AI Technical Summary

Problems solved by technology

It effectively solves the problem of poor heat dissipation and easy dust accumulation of existing air heat conduction radiators, especially the bulky problems of high-performance graphics card radiators

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