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Novel heat-isolating board for building

A new type of thermal insulation technology, which is applied in the preparation of lightweight thermal insulation wall panels and the preparation of thermal insulation panels, which can solve the problems of low thermal insulation coefficient and so on.

Inactive Publication Date: 2014-06-11
王金山
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the currently used building wall materials are earth-fired bricks, which have a low thermal insulation coefficient

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] The preparation method of the light-weight thermal insulation wallboard is composed of the following components in weight percentage: 95% of crushed plant straw, shrub branches and leaves, and processed wood waste, 5% formaldehyde-free white latex specially used for thermal insulation wooden wallboard %. When in use, spray the mixed solution glue into crushed plant stalks, shrub branches and leaves, and processed wood waste, etc., and place it in a frame model according to a certain amount, and heat it to 200 degrees for hot pressing. . After exiting the model, place it in a ventilated and dry place for further air drying.

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PUM

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Abstract

The invention discloses a novel heat-isolating wall board and particularly relates to a light heat-isolating wall board for a building which is relatively low in heat transfer coefficient. The light heat-isolating wall board comprises the following components in percentage by weight: 95 percent of crushed plant straw, shrub branches and leaves, waste powder of processed wood boards and the like, and 5 percent of formaldehyde-free white latex which is special for a heat-isolating wood wall board. In use, mixed glue solution is sprayed onto crushed scrapes of crushed plant straw, shrub branches and leaves, waste powder of processed wood boards and the like; certain amount of components is placed in a frame model and is heated to the temperature of 200 DEG C to be thermally pressed and molded; after being de-molded, the molded product is placed at a ventilating dry place to be further aired to be dry.

Description

[0001] The technical field mentioned: [0002] The invention relates to a method for preparing a heat insulating board, in particular to a lightweight heat insulating wall board for buildings with a low heat transfer coefficient. Background technique: [0003] Most of the currently used building wall materials are earth-fired bricks, which have a low thermal insulation coefficient. Invention content: [0004] In order to overcome the above-mentioned shortcomings in the prior art, the object of the present invention is to provide a method for preparing a lightweight thermal insulation wallboard. This kind of lightweight thermal insulation wallboard can achieve sufficient heat insulation effect, can be installed on the inner side of the building wall, and can replace the secondary decoration with its own pattern. [0005] Technical scheme of the present invention is: [0006] A method for preparing a lightweight heat-insulating wallboard. The invention relates to a method fo...

Claims

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Application Information

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IPC IPC(8): B27N3/08
Inventor 王金山
Owner 王金山
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