Imaging module

一种摄像模块、摄像元件的技术,应用在图像通信、电视、光学等方向,能够解决第二螺钉紧固力减弱、摄像模块防水性下降、减弱第二螺钉紧固力等问题

Inactive Publication Date: 2014-05-28
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] On the other hand, in order to reduce the size of the camera module and reduce the size of the screw fastening part, if the diameter of the screw is reduced, the strength of the screw fastening will be insufficient.
In this way, when the bracket is screwed onto a motor vehicle or the like, the vibration of the motor vehicle or the like weakens the fastening force of the second screw, so there is a problem that the optical axis is shifted and the image quality is likely to deteriorate.
[0009] In addition, since the fastening force of the second screw is weakened, the rear case and the bracket are misaligned, and there is a problem that the waterproofness of the camera module is lowered.

Method used

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Embodiment

[0069] Hereinafter, an embodiment of the camera module 1 of the present invention will be described.

[0070] figure 1 and figure 2The camera module of the embodiment of the structure shown is fabricated as follows. First, a rectangular cylindrical front cabinet 3 made of polycarbonate formed by injection molding and a square box-shaped rear cabinet 4 made of polycarbonate formed by injection molding are prepared. In the front case 3, the square cross section has dimensions of 23 mm in length and 23 mm in width and 10 mm in height. In the rear case 4, the square cross section has dimensions of 23 mm in length and 23 mm in width and 13 mm in height. Furthermore, the front case 3 has a cylindrical lens barrel 6 inside.

[0071] Next, the lens unit 2 composed of three lenses is installed on the lens barrel 6 inside the front case 3 , and the lens unit 2 is fixed by the ring-shaped retainer 12 . And the connection terminal 9 provided on the lens barrel 6 inside the front case...

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Abstract

The present invention provides an imaging module for reducing the size of screw fastening portions for mounting a front case, a rear case and a bracket, maintaining high screw fastening strength, and suppressing optical axis length change or optical axis deviation between a lens unit and an imaging element when the bracket is mounted to an automobile or the like by screw fastening. An imaging module (1) includes: a front case (3) which is configured to mount a lens unit (2) on a subject side; a rear case (4) which is mounted to the front case and configured to seal an imaging substrate (8) in an interior space between the rear case and the front case; and a bracket (5) mounted to the rear case. The rear case is mounted to the front case with first screws (10) which is screwed into screw fastening holes (3a) and first screw fastening through-holes (4a), and the bracket (5) is mounted to the rear case (4) with second screws (11), which are screwed into the first screw fastening through-holes (4a) and second screw fastening through-holes (5a) and have a diameter larger than that of the first screws (10).

Description

[0001] This application is a divisional application of an invention patent application with an international filing date of February 17, 2010, an application number of 201080007023.5 (international application number PCT / JP2010 / 052302), and an invention title of "camera module". technical field [0002] The present invention relates to an imaging module using an imaging element including a semiconductor image sensor typified by a CCD image sensor. Background technique [0003] A conventional camera module having a bracket for mounting on an automobile or the like has, for example, the following structure. [0004] Specifically, the structure includes: a front case in which the lens unit is installed on the subject side, and an imaging substrate on which the imaging element is mounted is provided at a position opposite to the subject side, and the imaging element and the lens unit opposite; the rear shell, which is installed on the front shell to seal the imaging substrate in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225G03B17/08
CPCH04N23/51H04N23/54H04N23/57
Inventor 森岛理洋辻克美
Owner KYOCERA CORP
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