Manufacturing method for multilayer thick copper circuit board and manufacturing method for two-sided thick copper circuit board

Abstract

The invention discloses a manufacturing method for a multilayer thick copper circuit board and a manufacturing method for a two-sided thick copper circuit board. The manufacturing method for the multilayer thick copper circuit board comprises the steps of enabling every two of N layers of thick copper plates to undergo press fit through strippable adhesion pieces to form N / 2 thick copper plate groups; performing primary two-sided etching on every thick copper plate group, and enabling the primary two-sided etching depth to be smaller than the thickness of every layer of thick copper plate of the thick copper plate groups; utilizing press fit adhesion pieces to perform primary press fit on the thick copper plate groups after the primary two-sided etching, separating every two layers of thick copper plates of the thick copper plate groups, enabling every two adjacent layers of thick copper plates in the thick copper plate groups to form (N / 2-1) inner layer plates, and enabling two independent layers of thick copper plates to respectively form outer layer copper; performing secondary two-sided etching on every inner layer plate, and enabling the secondary two-sided etching depth to be equal to the difference between the thickness of every layer of thick copper plate and the primary two-sided etching depth; utilizing press fit adhesion pieces to perform secondary press fit on the inner layer plates and the outer layer copper after the secondary two-sided etching; and performing two-sided etching on the outer layer copper for a third time.

Description

technical field [0001] The invention relates to the field of printed circuit board processing, in particular to a method for manufacturing a multilayer thick copper circuit board and a method for manufacturing a double-sided thick copper circuit board. Background technique [0002] In the solder mask manufacturing process of printed circuit boards, etching and lamination are the core processing techniques of printed circuit boards. Now in the industry, thick copper circuit boards have appeared. The copper layer of this thick copper circuit board has 4OZ, and some Even more than 12OZ, this kind of thick copper board is generally used on double-sided or 4-layer boards, for example, it can be used as a connector, but when making thick copper circuit boards, the two processes of etching and pressing have encountered difficulties, mainly in The following aspects: [0003] First, thin lines cannot be processed due to etching problems; please refer to figure 1 As shown, because t...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problems in the prior art that fine lines cannot be produced during the etching process of thick copper circuit boards and holes are formed due to insufficient glue filling in the pressing process, resulting in easy explosion of the board, the present invention provides a multilayer thick copper circuit board Board manufacturing method and double-sided thick copper circuit board manufacturing method

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