Liquid injection device and its integral molding manufacturing method

A technology of jetting device and manufacturing method, which is applied in printing and other directions, can solve the problems of poor printing quality, low yield of liquid jetting device, high manufacturing cost, etc., and achieve the effects of improving yield, avoiding damage, and improving printing quality

Active Publication Date: 2016-02-03
DALIAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention provides a liquid ejecting device and its integrated manufacturing method, which are used to solve the problems of low yield, high manufacturing cost and poor printing quality of the liquid ejecting device manufactured by the integrated manufacturing method of the liquid ejecting device in the prior art defect

Method used

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  • Liquid injection device and its integral molding manufacturing method
  • Liquid injection device and its integral molding manufacturing method
  • Liquid injection device and its integral molding manufacturing method

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Embodiment Construction

[0022] figure 1 A flow chart of a liquid injection device integrated manufacturing method provided by an embodiment of the present invention, as shown in figure 1 As shown, the liquid injection device integrated manufacturing method provided in this embodiment includes:

[0023] Step 100, forming a plurality of spaced apart pressure generating components on a first substrate.

[0024] Step 200, forming pressure chambers corresponding to the plurality of pressure generating components and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate.

[0025] specifically, figure 2 for figure 1 A flowchart of a specific embodiment of step 200; as figure 2 As shown, step 200, forming pressure chambers corresponding to the plurality of pressure generating components on the first surface of the first substrate and a common chamber communicating with the plurality of pressure chambers may include:

[0026] Step 201, dispos...

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Abstract

The invention provides a liquid injecting device and an integrated molding manufacturing method thereof, wherein the method comprises the steps of: forming a plurality of separately arranged pressure generating components on a first substrate; forming a plurality of pressure chambers which correspond with the plurality of pressure generating components and a common chamber that is communicated with the plurality of pressure chambers on the first surface of the first substrate; and forming a spraying hole board on each pressure chamber through a bonding process and forming spraying holes which are communicated with the pressure chambers on the spraying hole boards through a photoetching process. According to the liquid injecting device and the integrated molding manufacturing method provided by the invention, pressure chambers and the common chamber are formed on the first surface of the first substrate. When number increase of pressure chambers of the liquid injecting device is required, because the pressure chambers are separately formed on the first substrate according to the embodiment, the mechanical strength of the first substrate is not required, and first substrate damage can be prevented in the manufacturing process, thereby improving qualified rate of the liquid injecting device and reducing manufacturing cost.

Description

technical field [0001] The invention relates to printer technology, in particular to a liquid ejecting device and an integrated manufacturing method thereof. Background technique [0002] The liquid ejecting device of the printer changes the volume of the pressure chamber through the deformation of the piezoelectric element and the vibrating plate, so that the ink in the pressure chamber is ejected from the nozzle hole. [0003] An existing liquid injection device includes a base, a vibrating plate and a piezoelectric element arranged on the first surface of the base, and an orifice plate bonded on the second surface of the base (the side opposite to the first surface). The existing manufacturing method of the liquid ejecting device is: form a vibrating plate and a piezoelectric element on the first surface of the substrate, and etch a plurality of corresponding piezoelectric elements on the substrate through an etching process on the second surface of the substrate. The pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/16B41J2/14
Inventor 邹赫麟何敬志李越陈晓坤
Owner DALIAN UNIV OF TECH
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