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Cyanide-free bright electrogilding additive and application thereof

A bright electroplating and inorganic additive technology, applied in the field of electroplating gold, can solve the problems of narrow process range, low stability of plating solution, poor coating quality, etc., and achieve the effect of uniform appearance, excellent performance and improved coating performance.

Active Publication Date: 2014-04-23
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to develop a kind of electroplating gold additive that can be applied to cyanide-free electroplating gold system and be used in electroplating gold process by the preparation of electroplating gold additive and the optimization of electroplating gold process, reach to improve plating bath stability, Increase the application range of the electroplating process and increase the electrodeposition rate, in order to obtain a gold-plated layer whose coating performance is comparable to that of the cyanide coating, and realize the cyanide-free electroplating system. The purpose of replacing cyanide electroplating gold is to fundamentally solve the defects of the current cyanide-free electroplating system, such as low stability of the plating solution, poor quality of the coating, and narrow process range.

Method used

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  • Cyanide-free bright electrogilding additive and application thereof
  • Cyanide-free bright electrogilding additive and application thereof
  • Cyanide-free bright electrogilding additive and application thereof

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specific Embodiment approach 1

[0015] Embodiment 1: The cyanide-free bright electroplating gold plating additive in this embodiment is one or more organic additives, or a mixture of one or more inorganic additives and organic additives.

[0016] The electroplating gold process operation is as follows:

[0017] 1. Additive preparation: Weigh one or more inorganic additives and organic additives, or one or more organic additives, and use ultrapure water to prepare a clear solution, store at constant volume, and obtain the solution of the electroplating gold additive. The prepared plating solution is prepared by ultrapure water with a resistivity of 18MΩ / cm, and the concentration of each component of the additive in the solution is 0.5-30g / L. The main purpose of the electroplating gold additive in this system is to realize that the performance of the plating solution and coating can be comparable to that of the cyanide electroplating gold system.

[0018] 2. Preparation of electroplating gold plating solution...

specific Embodiment approach 2

[0023] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the concentration of each component in the electroplating gold additive is: antimony potassium tartrate 10g / L, polyethylene glycol 5g / L, guanine 5g / L , 5g / L of succinimide, and the amount of additives in electroplating gold is 0.5mL / L. The appearance of the coating obtained in the bath without additives is not bright, and the crystals are relatively coarse. The coating obtained in the bath containing additives is uniform and flat, golden and bright, and the microscopic crystals are uniform, small, flat and dense, and free of cracks by SEM observation. The SEM images of the electroplated gold coating obtained by the plating solution without additives and the plating solution after adding additives are as follows figure 1 with figure 2 shown.

specific Embodiment approach 3

[0024]Specific embodiment three: the difference between this embodiment and specific embodiment two is that the concentration of each component in the described electroplating gold additive is: use potassium selenite 5g / L, saccharin 10g / L, 1,4-butyne Glycol 5g / L, sodium lauryl sulfate 1g / L prepare electroplating gold additives, the amount of additives in electroplating gold is 10mL / L, the obtained coating is macroscopically uniform and smooth, golden and bright, and the microscopic crystals are uniform, small and smooth under SEM observation Dense, no cracks.

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Abstract

The invention discloses a cyanide-free bright electrogilding additive and an application thereof, which belongs to the technical field of electrogilding. The electrogilding additive is prepared from additives and ultra-pure water, wherein the additives are organic additives or mixtures of inorganic additives and organic additives; the concentration of each component in the additive is 0.5-30g / L. The cyanide-free bright electrogilding additive disclosed by the invention has the functions of improving the brightness of a plated layer, refining crystal grains, stabilizing plating liquid and reducing surface tension. Therefore, the additive can be applied to electrogilding plating liquid, and the addition amount is 0.1-100mL / L. By adopting the additive disclosed by the invention, the properties of the plating liquid and the plating layer of a multi-coordination agent cyanide-free electrogilding system can be effectively improved, the plating liquid has no unstable situations of decomposition, precipitation and the like under long-time working condition, and an electrogilding layer which is golden and full bright macroscopically, uniform and compact in micro crystal, flat and crackless can be obtained under the electroplating condition.

Description

technical field [0001] The invention belongs to the technical field of electroplating gold, and relates to a cyanide-free bright electroplating gold additive and its use in an electroplating gold process. Background technique [0002] The addition of electroplating additives can make the gold-plated layer have good appearance gloss, electrical conductivity, weldability, high temperature resistance and wear resistance, so it can meet the application requirements of electroplating gold in various industries, such as jewelry, commemorative coins, electronics, instruments , instrumentation, aviation, aerospace and other industrial fields. [0003] Gold cyanide electroplating can obtain a gold plating layer with excellent performance at a lower cost, so it is used in various industries, but CN - It is a highly toxic substance, which will cause great harm to operators and the environment. Therefore, in order to implement sustainable development, realize environmental protection ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48
Inventor 安茂忠任雪峰张锦秋宋英刘安敏
Owner HARBIN INST OF TECH
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