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Preparing method of ring-shaped Kraft microelectrode based on self-stress bending

A self-stressing, micro-electrode technology, applied in the field of medical devices, can solve the problems of unreported annular bending, unused material internal stress properties, complex structure, etc.

Active Publication Date: 2014-04-23
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is mainly closed by mechanical methods, and the structure is relatively complicated, and the internal stress properties of the material are not used.
[0006] In summary, although the ring-shaped Kraft electrode and its preparation method have been studied to a certain extent, there is no report in the literature on the method of using the stress of the electrode material itself to achieve ring-shaped bending. Therefore, the present invention provides an ultra-thin curved electrode. The ring-shaped kraft microelectrode preparation method solves this problem

Method used

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  • Preparing method of ring-shaped Kraft microelectrode based on self-stress bending
  • Preparing method of ring-shaped Kraft microelectrode based on self-stress bending
  • Preparing method of ring-shaped Kraft microelectrode based on self-stress bending

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Embodiment 1

[0038] This embodiment provides a method for preparing a flexible microelectrode based on Parylene-C, and during the preparation process, the thickness of the Parylene-C layer and the heat treatment conditions are controlled to realize ring-shaped bending based on self-stress to form a kraft electrode. The specific preparation process of the microelectrode is as follows:

[0039] First, deposit 10 μm Parylene-C (first layer) on the Si wafer, heat treatment at 200 degrees Celsius for 48 hours in vacuum or nitrogen atmosphere;

[0040] Secondly, throw 5 μm of positive glue on the heat-treated sheet and follow the figure 1 The microelectrode conductive structure layout shown is patterned, sputtering titanium or chromium seed layer, 100-500 angstroms, and then sputtering metal iridium, platinum or gold 100-500 nanometers, using Lift-off process to remove photoresist, graphics The chemical seed layer and the metal layer constitute the conductive structure of the electrode;

[004...

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Abstract

The invention provides a preparing method of a ring-shaped Kraft microelectrode based on self-stress bending. According to the method, in the preparing process, the ring-shaped bending based on the self stress is realized through controlling the thickness of Parylene-C layers and the heat treatment conditions and regulating the self-stress conditions of different Parylene-C layers, and a Kraft electrode is formed. The preparing method has the advantages that the operation is simple and convenient, and a series of annular Kraft electrodes in different diameters can be formed.

Description

technical field [0001] The invention relates to a method for preparing a microelectrode in the technical field of medical devices, in particular to a method for preparing a ring-shaped kraft microelectrode based on self-stress bending. Background technique [0002] In recent years, with the continuous advancement of MEMS (Micro-Electro-Mechanical Systems) technology, the application range of micro-systems such as micro-electronic devices and micro-sensors has continued to expand, and has been widely used in many fields, especially in the medical field. . [0003] Ring-shaped kraft electrodes have been used in the medical field to a certain extent, but most of them are complicated to prepare and require additional materials to provide stress to form a ring structure, which will also increase the thickness. The possible method of using the properties of the electrode material itself to generate bending stress has not received much attention. [0004] US Patent Publication No...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61N1/05A61B5/04
Inventor 刘景全康晓洋田鸿昌杨春生
Owner SHANGHAI JIAO TONG UNIV
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