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Dicing sheet substrate film and dicing sheet

A substrate film, cutting sheet technology, applied in film/sheet adhesive, transportation and packaging, non-polymer adhesive additives, etc., can solve the problem of yield drop, damage to package, poor device operation, etc. problem, to achieve the effect of easy production and reduction of cutting chips

Active Publication Date: 2014-04-16
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When a large amount of filamentous dicing swarf as described above is attached to the chip and the chip is packaged, the filamentous dicing swarf attached to the chip is decomposed by the heat of the package, and the thermal decomposition product will destroy the package or become a component of the resulting device. Bad reason
Since this filamentous cuttings are difficult to remove through cleaning, the productivity of the cutting step is significantly reduced due to the generation of filamentous cuttings

Method used

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  • Dicing sheet substrate film and dicing sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] (1) Production of substrate film

[0120] The tensile modulus at 23° C. of a cycloolefin copolymer (manufactured by Polyplastics Co., Ltd., product name TOPAS (registered trademark) 8007) which is a thermoplastic resin containing an aliphatic ring-containing resin (a1) (based on the test example described later) The results obtained in 1, the same below): 2.0 GPa, the fluidization temperature (based on the results obtained in Test Example 2 described later, the same below): 142° C.) 5.0 parts by mass, which is as low as the non-cyclic olefin resin (a2) Density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., product name Sumikasen (registered trademark) L705, tensile modulus at 23°C: 140 MPa) 95.0 parts by mass, using a twin-screw kneader (manufactured by Toyo Seiki Seisakusho Co., Ltd. ) was melt-kneaded at 210°C to obtain an extrusion raw material for the resin layer (A). This raw material was extruded through a small T-die extruder (Toyo Seiki Seisakusho C...

Embodiment 2

[0125] Dicing sheets were produced in the same manner as in Example 1, except that the content of the ring-containing resin (a1) in Example 1 was changed to 30.0 parts by mass and the content of the acyclic olefin-based resin (a2) was changed to 70.0 parts by mass. The internal haze value of the obtained resin layer (A) was 29.8%.

Embodiment 3

[0127] Dicing sheets were produced in the same manner as in Example 1, except that the content of the ring-containing resin (a1) in Example 1 was changed to 50.0 parts by mass and the content of the acyclic olefin-based resin (a2) was changed to 50.0 parts by mass. The internal haze value of the obtained resin layer (A) was 47.8%.

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Abstract

Provided is a dicing sheet substrate film which, without requiring additional physical energy such as an electron beam or gamma rays, can reduce dicing debris generated during dicing of an object being cut. This dicing sheet substrate film (2) is provided with a resin layer (A). The resin layer (A) contains a ring-containing resin (a1) which is a thermoplastic resin having, as a structural unit, monomers having at least one of an aromatic ring or an aliphatic ring, and an acyclic olefin resin (a2) which is an olefin-based thermoplastic resin other than the ring-containing resin (a1), wherein the content of the ring-containing resin (a1) in the resin layer (A) is greater than 3.0 mass%. Also provided is a dicing sheet (1) which is provided with the dicing sheet substrate film and an adhesive layer (3) arranged on said film.

Description

technical field [0001] The present invention relates to a dicing sheet to which a cutting object such as a semiconductor wafer is cut and separated into element pieces, and a base film used for the dicing sheet. Background technique [0002] Semiconductor wafers such as silicon and gallium arsenide and various packages are produced in a large-diameter state (hereinafter, they are sometimes collectively described as "cut objects"), and they are cut and separated (diced) into small element pieces (hereinafter referred to as "chip"). [0003] For the cut object delivered to the dicing step, the dicing sheet is pasted on the side close to the cutting tool for cutting for the purpose of realizing the handleability of the cut object and chips in the dicing step and subsequent steps The surface of the cut object on the opposite side. Such a dicing sheet generally uses a polyolefin-based film, a polyvinyl chloride-based film, or the like as a base film on which a pressure-sensitiv...

Claims

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Application Information

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IPC IPC(8): H01L21/301C09J7/02C09J11/06C09J133/08C09J175/14
CPCC09J7/0271H01L21/6836C09J2203/326C09J175/14C09J2201/606H01L2221/68327C09J7/241C08G18/6229C08G18/6254C08G2170/40C09J133/14C08L23/06C09J7/381C09J7/385Y10T428/28C09J2301/302C08L23/0823H01L21/30
Inventor 田矢直纪上田公史佐藤阳辅伊藤雅春
Owner LINTEC CORP
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