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Metal substrate with high thermal conductivity and manufacturing method thereof

A metal substrate and manufacturing method technology, applied in the direction of printed circuit manufacturing, printed circuit components, electrical components, etc., can solve the problem of not having high frequency characteristics, not having heat dissipation performance, and unable to effectively meet the high heat dissipation of electronic components, etc. question

Active Publication Date: 2017-07-07
江苏生益特种材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, the application of LCP in copper clad laminates mainly focuses on the production of copper clad laminates for high frequency circuits. Although this kind of board has excellent dielectric properties, the thermal conductivity of the whole board is not good, and it cannot effectively meet the high heat dissipation of electronic components.
Similarly, ordinary high-frequency copper clad laminates do not have good heat dissipation performance, and conventional high-thermal conductivity plates do not have high-frequency characteristics.

Method used

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  • Metal substrate with high thermal conductivity and manufacturing method thereof
  • Metal substrate with high thermal conductivity and manufacturing method thereof
  • Metal substrate with high thermal conductivity and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] On both sides of the porous LCP film with a thickness of 50 μm and a porosity of 50%, the above-mentioned cyanate thermally conductive glue with a thickness of 15 μm and a thermal conductivity of 4.0 W / m. Material prepreg; coat a layer of epoxy heat-conducting glue with a thickness of 40 μm on the roughened surface of copper foil of 35 μm and a thermal conductivity of 2.0 W / m.K. After heating and baking, glue-coated copper foil is obtained. / LCP prepreg / glue-coated copper foil laminate structure, for lamination, the specific structure is as follows figure 2 , sandwich the above prepared laminated blanks between two mirror-finished stainless steel plates, and then put them into a laminator, at a temperature of 200 ° C, a pressure of 4 MPa, and a pressing time of 90 minutes to obtain a high thermal conductivity metal substrate .

Embodiment 2

[0076] On each side of the porous LCP film with a thickness of 50 μm and a porosity of 70%, coat the above-mentioned cyanate thermally conductive glue with a thickness of 15 μm and a thermal conductivity of 4.0 W / m.K. After heating and baking, the LCP-reinforced Material prepreg; coat a layer of epoxy heat-conducting glue with a thickness of 40 μm on the roughened surface of copper foil of 35 μm and a thermal conductivity of 2.0 W / m.K. After heating and baking, glue-coated copper foil is obtained. / LCP prepreg / glue-coated copper foil laminate structure, for lamination, the specific structure is as follows figure 2 , sandwich the above prepared laminated blanks between two mirror-finished stainless steel plates, and then put them into a laminator, at a temperature of 200 ° C, a pressure of 4 MPa, and a pressing time of 90 minutes to obtain a high thermal conductivity metal substrate .

Embodiment 3

[0078] On both sides of the porous LCP film with a thickness of 50 μm and a porosity of 90%, the above-mentioned cyanate thermally conductive glue with a thickness of 15 μm and a thermal conductivity of 4.0 W / m. Material prepreg; coat a layer of epoxy heat-conducting glue with a thickness of 40 μm on the roughened surface of copper foil of 35 μm and a thermal conductivity of 2.0 W / m.K. After heating and baking, glue-coated copper foil is obtained. / LCP prepreg / glue-coated copper foil laminate structure, for lamination, the specific structure is as follows figure 2 , sandwich the above prepared laminated blanks between two mirror-finished stainless steel plates, and then put them into a laminator, at a temperature of 200 ° C, a pressure of 4 MPa, and a pressing time of 90 minutes to obtain a high thermal conductivity metal substrate .

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Abstract

The invention relates to a high thermal conductivity metal substrate and a manufacturing method thereof. The high thermal conductivity metal substrate includes a porous LCP film, a thermally conductive insulating layer with a thermal conductivity of 2-6W / m.K coated on both sides of the porous LCP film, and a thermally conductive layer with a thermal conductivity of 1-4W / m.K coated on the metal foil. Insulation layer and metal foil. The high thermal conductivity metal substrate is prepared by coating the two sides of the porous LCP film and one side of the metal foil with a thermally conductive insulating layer, and then pressing them together. The metal substrate prepared by the invention not only has high thermal conductivity but also has excellent dielectric properties.

Description

technical field [0001] The invention relates to a metal substrate and a manufacturing method thereof, in particular to a high-thermal-conductivity metal substrate for a high-frequency circuit and a manufacturing method thereof. Background technique [0002] In recent years, with the development of high-performance and high-functionalization of computers and information communication equipment, in order to be able to transmit and process large-capacity information at high speed, the operating signal tends to be more high-frequency, so higher requirements are put forward for electronic circuit substrates. Requirements, which include excellent dielectric properties, that is, low dielectric constant and low dielectric loss factor. Moreover, the "light, thin, short, and small" of electronic products has made circuit boards more and more integrated, with more and more components on board, and more and more heat emitted per unit area during work. To ensure the stability and reliab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 邓华阳许永静黄增彪
Owner 江苏生益特种材料有限公司
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