Wafer selection device

Abstract

The invention relates to a wafer selection device, which comprises a substrate, wherein two transverse-line-shaped supporting feet are arranged below the substrate; the middle of the substrate is upwards provided with a selection platform; the parts on the left end and the right end of the selection platform, of the substrate, are respectively provided with a finished product conveying groove and a reject conveying groove; a finished product conveying belt is arranged in the finished product conveying groove; the right side driving wheel of the finished product conveying belt is fixedly provided with a first driven wheel by a bearing; a reject conveying belt is arranged in the waste conveying groove; the left side driving wheel of the reject conveying belt is fixedly provided with a second driven wheel by a bearing; the outer side of the finished product conveying groove and the outer side of the reject conveying groove are respectively provided with a finished product receiving hole and a reject receiving hole; a support plate is arranged between the supporting feet and is provided with a drive wheel, a third driven wheel, a fourth driven wheel and a fifth driven wheel; therefore, manpower is greatly saved and cost is greatly reduced.

Description

technical field [0001] The invention relates to a wafer selection device, which is applied in the field of wafer processing. Background technique [0002] During the silicon wafer selection process, trays are generally used for wafer selection. Since the processed wafers are thin and small in size, it is necessary to cover the tray with black cloth or black leather to facilitate wafer selection. Because the cloth or black leather is easy to produce fine debris, it will pollute the chip display and affect the normal operation of electronic components. [0003] Recently, there is a wafer sorting device, which includes a sorting platform. The sorting platform is installed on a support, and the picking platform is made of dark glass. The structure of the device is too simple, and the wafers need to be sorted manually after sorting , more troublesome, waste of time and manpower. Contents of the invention [0004] The technical problem to be solved by the present invention is ...

AI Technical Summary

Problems solved by technology

Because the cloth or black leather is easy to produce fine particles, which will cause pollution to the chip display and affect the normal operation of electronic components

[0003] Recently, there is a wafer sorting device, including a sorting platform. The sorting platform is installed on a support, and the picking platform is made of dark glass. The structure of the device is too simple, and the wafers need to be sorted manually after sorting , more troublesome, waste of time and manpower

Images