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Laser direct structuring heat-conducting insulating resin and preparation method thereof

A technology of laser direct molding, thermal conductivity and insulation, applied in the field of polymer resin, can solve the problems of general thermal conductivity and difficult to achieve, and achieve the effect of free circuit design, improved thermal conductivity, and firm circuit design.

Active Publication Date: 2014-04-02
SHANGHAI KUMHO SUNNY PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of ceramic fillers is average, and it is difficult to achieve a thermal conductivity above 5W / m.K.

Method used

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  • Laser direct structuring heat-conducting insulating resin and preparation method thereof
  • Laser direct structuring heat-conducting insulating resin and preparation method thereof
  • Laser direct structuring heat-conducting insulating resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The components are in weight ratio: PPS52, C-Therm011 20, BN20, 1G 8. It is extruded by a twin-screw extruder with a melting temperature of 200-290°C and pelletized. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-290°C, the temperature of zone 3-4 is 200-290°C, the temperature of zone 5-6 is 200-290°C, and the temperature control is 7- The temperature in Zone 8 is 200-290°C, and the temperature in Zone 9-10 is 200-290°C.

Embodiment 2

[0033] Ratio of each component by weight: PPS55, C-Therm011 20, BN20, 1G 5. It is extruded by a twin-screw extruder with a melting temperature of 200-290°C and pelletized. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-290°C, the temperature of zone 3-4 is 200-290°C, the temperature of zone 5-6 is 200-290°C, and the temperature control is 7- The temperature in Zone 8 is 200-290°C, and the temperature in Zone 9-10 is 200-290°C.

Embodiment 3

[0035] Ratio of each component by weight: PPS35, C-Therm011 20, BN40, 1G 5. It is extruded by a twin-screw extruder with a melting temperature of 200-290°C and pelletized. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-290°C, the temperature of zone 3-4 is 200-290°C, the temperature of zone 5-6 is 200-290°C, and the temperature control is 7- The temperature in Zone 8 is 200-290°C, and the temperature in Zone 9-10 is 200-290°C.

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Abstract

The invention relates to a laser direct structuring heat-conducting insulating resin and a preparation method thereof. The laser direct structuring heat-conducting insulating resin is prepared from the following raw materials in parts by weight: 35-55 parts of matrix resin, 40-60 parts of a heat-conducting agent, 5-8 parts of a laser additive, and 0.1-0.9 part of other ingredients. Compared with the prior art, the heat-conducting agent is added in the resin so as to realize heat conduction and insulation, meanwhile, the laser additive is also added so as to achieve the aim of laser direct structuring; the preparation method is mainly used in LED (Light-Emitting Diode) industry, can substitute steel with plastic, simplify process and reduce cost, and also can design circuits into the material, so that design can be more free and firmness is improved greatly.

Description

technical field [0001] The invention relates to a polymer resin used in the field of LEDs, in particular to a thermally conductive and insulating resin directly formed by laser and a preparation method thereof. Background technique [0002] The melting point of polyphenylene sulfide is higher than 280°C, the heat distortion temperature is higher than 260°C, and the long-term use temperature is 220-240°C; [0003] It has flame retardancy itself, and its flame retardancy can reach UL94V-0 level. It does not need to add any flame retardant when making flame retardant products, which maintains the high mechanical properties of the material itself; extremely rigid, high surface hardness, and high modulus , and has excellent creep resistance and fatigue resistance; excellent chemical resistance, has not yet found a solvent that can dissolve PPS below 200 ° C, can withstand low temperature -70 ° C and long-term salt spray environmental conditions, inorganic acids, Strong resistanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08L25/06C09K5/14C08K13/02C08K3/04C08K3/38C08K3/32C08K3/30
Inventor 杨春华李强罗明华辛敏琦
Owner SHANGHAI KUMHO SUNNY PLASTICS
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