Lamination sheet-type heat and pressure sensitive composite resistor and preparation method thereof

Abstract

The invention discloses a lamination sheet-type heat and pressure sensitive composite resistor and a preparation method thereof. The composite resistor consists of a pressure sensitive resistor part, an intermediate transition layer part and a heat sensitive resistor part by overlaying, wherein the structure of the pressure sensitive resistor part is the alternative overlapping and lamination combination of a pressure sensitive resistor porcelain sheet, a first electrode layer, a pressure sensitive resistor porcelain sheet and a second electrode layer; the first electrode layer and the second electrode layer are staggered respectively; the structure of the heat sensitive resistor part is the alternative overlapping and lamination of a heat sensitive resistor porcelain sheet, a third electrode layer, a heat sensitive resistor porcelain sheet and a fourth electrode layer; the third electrode layer and the fourth electrode layer are staggered respectively; the intermediate transition layer part is positioned between the heat sensitive resistor part and the pressure sensitive resistor part. According to the invention, a cofiring technique that base metal nickel is adopted as an internal electrode is adopted, so that the cost can be reduced; the preparation process can be simplified; the device reliability can be improved; the heat conduction path can be reduced; the protection effect to the pressure sensitive resistor by a heat sensitive element is enhanced; meanwhile, the multi-protection of overheating, overcurrent, overvoltage and the like of a circuit can be achieved.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic ceramic components, and in particular relates to a laminated chip thermal pressure-sensitive composite resistor and a preparation method thereof. Background technique [0002] Electronic appliances are rapidly developing in the direction of miniaturization, low cost, and high-density integration, prompting semiconductor-sensitive ceramic components to gradually become multi-layer and multi-functional. Three-dimensional integration is the best solution to achieve multi-functional and multi-device integration of passive electronic devices, which requires the co-firing of metal internal electrodes and ceramic materials. Metal internal electrode materials are easily oxidized at high temperatures, so they need to be co-fired in a reducing or inert protective atmosphere. However, since most semiconductor ceramics are sintered in this atmosphere, their electrical properties will be redu...

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Problems solved by technology

The Japanese Murata patent JP1152704 in 1989, the Korean patent KR20060093628 in 2005, and the patent CN102047353 applied by Dern and Thorn KG in China in 2011 all use mechanical mounting to prepare thermal / pressure-sensitive composite components, but this This method has complex preparation process, high cost and low reliability

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