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Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology

An inkjet printing and piezoelectric technology, which is applied in the field of preparing printed electronic solder resist materials based on piezoelectric household inkjet printing technology, can solve the problems of restricting the development of the printed electronics industry, expensive printers, and expensive nozzles. , to achieve the effect of saving solder mask ink materials, increasing reliability and yield, and high efficiency

Inactive Publication Date: 2014-02-12
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, solder resist coating in the printed electronics industry has developed rapidly in the field of high-density interconnection, but professional inkjet printers that can achieve this process are currently expensive, and the piezoelectric printers that can be used for inkjet printing produced by Fujifilm Dimatix Inc, The price is more than 3 million RMB, and the price of consumables such as nozzles is also very expensive
The high price has greatly restricted the development of the printed electronics industry. This invention aims to realize the inkjet printing of solder resist ink through a low-cost household printer, and achieve an effect similar to that of a professional printer, so as to solve the problem of expensive professional printers. The problem

Method used

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  • Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology
  • Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology
  • Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Using Epson Me1+ piezoelectric inkjet printer, UV curing solder resist ink formula as figure 1 As shown (70% solder resist resin (PEG modified E51 epoxy resin), 25% curing agent (Dow Chemical, UVI-6976), 5% curing accelerator (Dow Corning, Z-6040)), respectively, the resin ink Put the cyan ink cartridge (C), the curing agent into the magenta ink cartridge (M), the curing accelerator into the yellow ink cartridge (Y), and the cleaning agent into the black ink cartridge (K). First, adjust the printer to be all black and clean the bumper 3 times, then put the flex PCB to be printed (the substrate is PI) into the carton, and print the positioning holes and positioning points. Prepare the PCB circuit solder mask pattern to be printed, adjust the ink output according to the CMYK color coordinates to 70% for cyan (C), 25% for magenta (M), 5% for yellow (Y), and 0 for black (K) %, the three inks are mixed at the meeting point of the printer to obtain the required solder resist...

Embodiment 2

[0033] Self-modified Epson R230 piezoelectric inkjet printer was adopted, and the original paper feeding system was changed to a belt-driven linkage paper feeding system (refer to the universal printer for modification). Heat curing solder resist ink formula (30% solder resist resin component 1 (PEG modified E51 epoxy resin), 35% solder resist resin component 2 (hyperbranched polyester Boltorn H20 modified acrylic resin), 10% curing agent Component 1 (triethylenetetramine), 10% curing agent component 2 (triethylamine), 5% curing accelerator (DMP-30 20wt% acetone solution)), respectively put solder resist ink resin component 1 into Cyan ink cartridge, solder resist ink resin component 2 into light cyan ink cartridge, curing agent component 1 into magenta ink cartridge, curing agent component 2 into light magenta ink cartridge, curing accelerator into yellow ink cartridge, cleaning solvent into Insert the black ink cartridge. First, adjust the printer to all black and clean the...

Embodiment 3

[0035]Self-modified Epson R230 piezoelectric inkjet printer and LED linkage UV light source are added. UV curable solder resist ink formula (30% solder resist resin component 1 (PEG modified E51 epoxy resin), 35% solder resist resin component 2 (hyperbranched polyester Boltorn H20 modified acrylic resin), 15% curing agent Component 1 (Dow Chemical, UVI-6976), 5% Curing Agent Component 2 (Dow Chemical, UVI-6992), 5% Curing Accelerator (Dow Corning, Z-6040)), the solder resist ink resin Component 1 is loaded into the cyan ink cartridge, solder resist ink resin component 2 is loaded into the light cyan ink cartridge, curing agent component 1 is loaded into the magenta ink cartridge, curing agent component 2 is loaded into the light magenta ink cartridge, and curing accelerator is loaded into the yellow ink cartridge Cartridge, cleaning solvent into the black cartridge. First, adjust the printer to all black and clean the head 3 times, then put the hard board PCB to be printed (t...

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Abstract

The invention belongs to the field of printed electronics, and particularly discloses a method for preparing a printed electronic resistance welding material based on a household piezoelectric inkjet printing technology. A low-viscosity resistance welding ink formula is fabricated by adopting an improved household piezoelectric inkjet printer; the total time from beginning of inkjet to curing molding does not exceed 5 minutes; meanwhile, the method disclosed by the invention has the characteristics of being simple to operate, economic in material, high in reliability and the like, and is applicable to preparation of a hard plate and a flexible plate of a printed circuit board (PCB), a resistance welding coating of a rigid-flexible board.

Description

technical field [0001] The invention belongs to the technical field of printed electronic inks, and relates to a method for preparing printed electronic solder resist materials based on piezoelectric household inkjet printing technology. Background technique [0002] The solder resist ink is coated on the outer layer of the PCB board pad to prevent the PCB board from being damaged by high temperature during the welding process with the chip, to prevent the circuit from being corroded and disconnected, and the bridging of the solder to cause a short circuit. The traditional solder resist coating adopts the method of silk printing, and the solder resist is first evenly coated on the entire PCB board surface. Make a mask for the part that needs to be soldered, UV cure the part that does not need to be soldered to form a protective layer, remove the mask, and then select a suitable cleaning agent to remove the solder resist on the part that needs to be soldered, and then proceed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/00
Inventor 杨振国杨超
Owner FUDAN UNIV
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