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Method for machining detection plate

A processing method and detection board technology are applied in the field of lithography machines, which can solve the problems of data deviation, low processing yield, and inability to meet the requirements of 90nm lithography machines.

Active Publication Date: 2014-02-05
SHANGHAI MODERN ADVANCED ULTRA PRECISION MFG CENT
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AI Technical Summary

Problems solved by technology

However, the data measurement and correction of the domestic processing detection board needs to remove the part from the machining center machine tool, and obtain the data on the separate measuring instrument to correct the equipment parameters, resulting in data deviation in the processing process, making the processing yield low, far from meeting 90nm Lithography machine requirements

Method used

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  • Method for machining detection plate

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Embodiment Construction

[0115] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but the protection scope of the present invention should not be limited thereby.

[0116] In order to prevent the solution of the influence of the temperature and humidity of the workshop where the gluing is located on the gluing, the temperature in the clean working room is 20-26°C±0.1°C, the humidity is 50-70%, and it is carried out under standard atmospheric pressure;

[0117] 1. Carry out the measurement of the positioning mark of the detection board and data processing, and the accuracy of the measured values ​​A, B, C, and D has reached ±0.01, which meets the precision requirements of the processing of the detection board. It is characterized in that the method comprises the following steps:

[0118] In the clean studio, the staff put on anti-static gloves, wipe the upper and lower planes of the glued detection board with anti-static optical glass c...

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Abstract

The invention discloses a machining and manufacturing process for a detection plate of a photo-etching machine, and particularly relates to a method for machining a detection plate. The method comprises the following steps: (1) measuring positioning marks of the detection plate, and processing data; (2) adjusting the reference accuracy of X and Y directions of a machining center machine tool and a clamp, and fixing a workpiece of the detection plate; (3) machining X-direction and Y-direction reference surfaces of the detection plate, and calibrating the accuracy of the reference surfaces and the reference of a cursor; (4) pre-machining all characteristics of the detection plate, and checking and verifying parameters of the machining center machine tool; (5) roughly machining an outline and internal characteristics; and (6) finely machining the outline and the internal characteristics. According to the invention, the rejection rate is reduced, the machined detection plate is high in quality, and requirements of photo-etching are met.

Description

technical field [0001] The invention relates to a lithography machine, in particular to a method for processing a detection plate of a step projection lithography machine. The detection plate is mainly used for position alignment of a detection mark of a step projection lithography machine, and the result directly affects the The silicon wafer in the step-by-step projection lithography machine is automatically aligned to the bit grating. Background technique [0002] At present, the equipment for processing detection boards in European and American countries is a special processing equipment with an online measuring device added to the precision milling machining center machining center machine tool. This type of equipment has not yet been sold to the outside world. With this kind of special processing equipment, the processed size can be measured during the processing of parts and the closed-loop data feedback can be used to correct the processing parameters of the processi...

Claims

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Application Information

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IPC IPC(8): G03F9/00G03F7/20
Inventor 黄克飞陈静顾亚平魏向荣
Owner SHANGHAI MODERN ADVANCED ULTRA PRECISION MFG CENT
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