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Ionic metal ink for ink-jet printing preparation of copper circuit graphs on printed board surface and its preparation method and printing method

A circuit pattern, metal ink technology, applied in the direction of copy/marking method, printing, ink, etc., can solve the problems of poor stability, easy oxidation and agglomeration, and achieve good catalysis, good adhesion and high stability. Effect

Active Publication Date: 2014-01-29
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the technical problems of poor stability of the existing nano-copper conductive ink, the need for post-sintering treatment, and easy oxidation and agglomeration during the sintering process, and provides an inkjet printed copper circuit on the surface of a printed board. Graphical ionic metal ink and its preparation and printing method

Method used

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  • Ionic metal ink for ink-jet printing preparation of copper circuit graphs on printed board surface and its preparation method and printing method
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  • Ionic metal ink for ink-jet printing preparation of copper circuit graphs on printed board surface and its preparation method and printing method

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specific Embodiment approach 1

[0038] Specific embodiment one: a kind of ionic metal ink used for inkjet printing copper circuit patterns on the surface of printed boards according to the present embodiment consists of 0.5-20 parts of bio-adhesive monomer, 0.01-5 parts After mixed reaction of metal salt, 3-10 parts of metal complexing agent, 55-95 parts of deionized water and 0.5-5 parts of pH buffering agent, 0.1-1 part of surface tension regulator, 0.1-4 parts The viscosity regulator adjusts the surface tension and viscosity of the ink, and finally adjusts the pH of the solution to 4-6 with a pH regulator; the bio-binder monomers are dopamine hydrochloride, norepinephrine, 5-hydroxydopamine, One or a combination of cidopa, α-methyldopamine, dexdopa, levodopa, α-methyldopa and nitrodopamine.

[0039] The bio-adhesive monomers in this embodiment all have a catechol structure, and are catalyzed by metal ions to be oxidized to generate a bio-adhesive under acidic conditions. When the biobinder monomers are a...

specific Embodiment approach 2

[0040] Embodiment 2: This embodiment differs from Embodiment 1 in that the pH buffer in the ionic metal ink is potassium hydrogen phthalate or sodium dihydrogen phosphate. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0041] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the viscosity regulator in the ionic metal ink is one of terpineol, methyl nylon acid or a combination of several of them; other and specific embodiment One or two the same.

[0042] In the present embodiment, when the viscosity modifier is a composition, various viscosity modifiers are combined in an arbitrary ratio.

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Abstract

The invention discloses an ionic metal ink for ink-jet printing preparation of a copper circuit graph on a printed board surface and its preparation method and printing method. The ionic metal ink is used for treatment on the printed board surface. The ionic metal ink solves the problem that the existing nano-copper conductive ink has poor stability, needs sintering aftertreatment and can be oxidized and agglomerated easily in the sintering. The preparation method of the ionic metal ink comprises that a bio-adhesive monomer, a metal salt, a metal complexing agent, deionized water and a pH buffering agent are mixed and undergo a reaction; the reaction products are added with a surface tension conditioning agent and a viscosity conditioning agent; and a pH value of the mixture is adjusted to 4-6. The printing method adopting the ionic metal ink comprises that the printed board surface is subjected to chemical degreasing and corona treatment; the ionic metal ink is spray-printed on the printed board surface to form circuit graphs composed of the ionic metal ink; the circuit graphs are dried at a low temperature; and the printed board surface with the circuit graphs is put into a chemical copper-plating solution for in-situ growth so that the copper circuit graphs are obtained. The printing method can be used for the technical field of printed electronics.

Description

technical field [0001] The invention relates to an ink used for surface treatment of printed boards and a surface treatment method thereof, in particular to an ink used for inkjet printing of copper circuit patterns on the surface of printed boards and inkjet printing on the surface of printed boards by using the ink Process of copper circuit pattern. Background technique [0002] The manufacturing methods of copper circuit patterns on the surface of printed boards mainly include photolithography and direct printing. Among them, the photolithography process is extremely complicated, and a large amount of copper (more than 70%) is wasted, and a lot of etching solutions that are harmful to the environment are used in the process, which causes great pressure on the environment. Inkjet printing is the most convenient direct printing method. As a non-contact electronic printing method, inkjet printed electronics has a simpler process than traditional photolithography. It only ne...

Claims

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Application Information

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IPC IPC(8): C09D11/30C09D11/52B41M5/00
Inventor 李宁王艳青黎德育
Owner HARBIN INST OF TECH
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