Mass pruduction method for manufacturing chip resistor

Abstract

A mass pruduction method for manufacturing chip resistors includes a solid pressing and bonding step, a resistor body defining step, a resistor forming step, an electrode forming step and a finished product obtaining step. In the solid pressing and bonding step, a first sheet and a second sheet are connected by an isolation material with high thermal conductivity. In the resistor body defining step, vertical penetrating slots and transverse penetrating slots are formed to define resistor blocks arranged by order arrays. In the resistor forming step, slits and at least one dividing penetrating groove are formed in each resistor block to enable the resistor blocks to be molded into resistor semi-finished products. In the electrode forming step, a conductor material is utilized to make each resistor semi-finished product form two electrodes that connects with resistor bodies. In the finished product obtaining step, the resistor bodies with electrodes are punched and trimmed to form multiple chip resistors.

Description

technical field [0001] The invention relates to a method for manufacturing a passive component, in particular to a method for manufacturing a micro metal resistor. Background technique [0002] refer to figure 1 , figure 2 , the existing miniature metal sheet resistor 1 includes a sheet-shaped resistor body 11 with a plurality of cut grooves 111, coating layers 12 formed on two opposite surfaces of the resistor body 11, and two respectively connected to the resistor body 11 in the lateral direction. The electrodes 13 on the opposite sides of the slits 111, any two adjacent slits 111 are respectively formed from the opposite sides where the electrodes 13 are not formed to the other side, whereby the resistor body 11 is cut Divided into a continuous dumping S-shaped current path, so that the miniature metal sheet resistor 1 presents a predetermined resistance value range during use. [0003] Roughly speaking, the existing miniature metal sheet resistor 1 is formed by rolli...

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Problems solved by technology

[0004] As far as the structure of the existing miniature metal sheet resistor 1 is concerned, since the resistance value (R) of the object is directly proportional to the product of the material coefficient (ρ) and the current path length (l) of the object, and is inversely proportional to the cross-sectional area (A), Therefore, when it is desired to increase the resistance value (R) of these miniature metal sheet resistors 1, it is necessary to thin the thickness of the resistor body 11, and / or increase the number of the cut grooves 111 to increase the current path length (l); but no matter Thinning the thickness of the resistor body 11, or increasing the number of cut grooves 111 on the resistor body 11 will result in poor overall structural strength. In addition, the miniature metal sheet resistor 1 will generate high temperature during use. High temperature will not only make the In addition to the thinning of the miniature metal sheet resistor 1, or the weakening of the structure caused by the cut groove 111 on the resistor body 11, the existing miniature metal sheet resistor 1 will also be due to only two and for example The electrode 13 connected to the circuit board dissipates heat outward, so there will be problems such as difficult heat dissipation, high temperature, drastic resistance value drift, and poor resistance characteristics. The selection of the coating layer 12 must be resistant to high temperature, which leads to a derivative problem of increased cost

[0005] As far as the manufacturing process of the existing micro-sheet metal resistor 1 is concerned, the existing micro-sheet metal resistor 1 is made by a series of mechanical forming methods such as plate rolling, punching, and material cutting. Holes, material cutting, etc. will continue to accumulate the manufacturing tolerances of the previous step, so there will be problems with insufficient accuracy of the final product

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