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Production method for ceramic aluminum-clad plate and ceramic aluminum-clad plate obtained by method

A technology of aluminum clad plate and ceramic plate, applied in the field of ceramic metallization, can solve the problems of low peel strength of ceramic aluminum clad plate, and achieve the effect of good interface continuity, high peel strength, area and probability reduction

Active Publication Date: 2015-06-24
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problem of low peeling strength of the existing ceramic aluminum-clad board, the present invention provides a preparation method of a ceramic aluminum-clad board with high peeling strength and the ceramic aluminum-clad board

Method used

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preparation example Construction

[0012] The present invention provides a kind of preparation method of ceramic aluminum-clad plate, and this method comprises the following steps:

[0013] S1. Rolling pretreatment: the metal aluminum plate A and the metal aluminum plate B are subjected to composite pretreatment by rolling to obtain a metal composite aluminum plate C;

[0014] S2. Brazing connection: the side of the metal aluminum plate A of the metal composite aluminum plate C is facing the ceramic plate, stacked on the ceramic plate, put the two together into a vacuum brazing furnace for brazing to obtain a ceramic aluminum clad plate;

[0015] Wherein, the melting point of the metal aluminum plate A is lower than the melting point of the metal aluminum plate B by at least 50°C.

[0016] According to the preparation method of the ceramic aluminum-clad plate provided by the present invention, preferably, the thickness of the ceramic plate is 0.3-1.5mm.

[0017] According to the preparation method of the ceram...

Embodiment 1

[0029] Metal aluminum plate B is aluminum 3003 with a melting point of 668°C; the composition of metal aluminum plate A is: silicon 11.7%, iron -3 At Pa, start to heat up at 10°C / min, and keep at 625°C for 5min. Stop heating after the heat preservation is over, and start air cooling as the furnace cools down to below 200°C. A ceramic aluminum-clad board A1 was obtained.

Embodiment 2

[0031] Metal aluminum plate B is aluminum 3003, with a melting point of 668°C; the composition of metal aluminum plate A is: silicon 10%, iron -3 At Pa, start to heat up at 15°C / min, and keep warm at 620°C for 4min. Stop heating after the heat preservation is over, and start air cooling as the furnace cools down to below 200°C. A ceramic aluminum-clad board A2 was obtained.

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PUM

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Abstract

The invention provides a preparation method of ceramic aluminum-clad plate, the method comprising the following steps: S1, rolling pretreatment: metal aluminum plate A and metal aluminum plate B are subjected to compound pretreatment by rolling method to obtain metal composite aluminum plate C; S2 . Brazing connection: put the metal aluminum plate A of the metal composite aluminum plate C towards the ceramic plate, stack it on the ceramic plate, put the two together into a vacuum brazing furnace for brazing to obtain a ceramic aluminum-clad substrate; wherein, The melting point of the metal aluminum plate A is lower than the melting point of the metal aluminum plate B by at least 50°C. The ceramic aluminum-clad plate prepared by the preparation method provided by the invention has good interface continuity and high peel strength, which can reach more than 180 N / cm.

Description

technical field [0001] The invention relates to the field of ceramic metallization, and more specifically relates to a ceramic aluminum-clad board and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, electronic devices tend to be high-power, high-density, and multi-functional, and the integration of electronic circuits is getting higher and higher, which inevitably generates a lot of heat when the circuit is working. In order to prevent electronic components from being damaged due to heat accumulation, ceramic materials with a thermal expansion coefficient matching semiconductor Si, high thermal stability, chemical stability and low dielectric constant have become the most widely used electronic substrate materials in the industry. Metal-ceramic composite materials combine the characteristics of ceramic insulation, high thermal conductivity, wear resistance, corrosion resistance, and high temperature resis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/02
Inventor 林信平周龙飞张伟锋
Owner BYD CO LTD
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