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Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes

A processing method and electric spark technology, which are applied in the field of processing micro-electric sparks to prepare three-dimensional microstructures, can solve the problems of serious micro-electrode loss, low processing efficiency, and difficulty in normal work for a long time, so as to reduce the micro-electrode loss and improve the The effect of processing efficiency and simple molding process

Inactive Publication Date: 2014-01-01
深圳市全达高分子材料科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, because the diameter of the cylindrical microelectrode is very small relative to the scanning area, the processing efficiency is very low
In addition, during the layer-by-layer scanning milling and electrical discharge machining of the micro-electrode, the wear of the micro-electrode is very serious, and it is difficult to work normally for a long time

Method used

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  • Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes
  • Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes
  • Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes

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Embodiment 1

[0051] Such as Figure 1 to 4 As shown, taking the electrode sheet material of copper foil with a thickness of 0.02 mm as an example, the specific processing method for producing the three-dimensional microstructure of copper foil includes the following steps:

[0052] 1) First, establish a CAD geometric model of the three-dimensional microstructure of the material to be processed through the three-dimensional computer-aided design CAD software system;

[0053] 2) Establish the corresponding CAD geometric model of the 3D micro-EDM electrode according to the established 3D microstructure CAD geometric model, and perform discrete slices of the 3D microelectrode to obtain the discrete slice geometric model;

[0054] 3) Convert the discrete slice geometric model of the three-dimensional microelectrode into a set of parallel slice electrode data models;

[0055] 4) The laser cutting system cuts the corresponding slice electrodes one by one on a piece of copper foil with a thickness of 0.02...

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Abstract

The invention relates to a processing method of a three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes. The processing method includes establishing three-dimensional microstructure CAD (computer-aided design) geometric models first, establishing three-dimensional minute electric spark electrode CAD geometric models corresponding to the established three-dimensional microstructure CAD geometric models, slicing the three-dimensional minute electric spark electrode CAD geometric models in dispersedness, transforming disperse slices geometric models into a group of slice electrode data models in mutually parallel, slicing corresponding slice electrodes on a slice electrode material one by one by a slice slicing system according to the slice electrode data models in a computer to acquire a group of slice electrode array, and performing minute electric spark machining. With the manufacturing method, electric discharge machining via large-size scanning and milling by layers of cylindrical microelectrodes is avoided when two-dimensional slice electrodes perform electric discharge machining, and an up and down type moving electric discharge mode can effectively increase machining efficiency and reduce microelectrode loss.

Description

technical field [0001] The invention relates to a processing method for a three-dimensional microstructure, in particular to a processing method for preparing a three-dimensional microstructure based on a thin electric discharge of a sheet electrode. Background technique [0002] Generally, the microstructure is defined as: at least on the two-dimensional scale, the article with submillimeter or micron-scale micro-feature structure is called micro (structural) parts. [0003] The preparation of three-dimensional microstructures by micro-electrode discharge machining is one of the mainstream processing methods for preparing three-dimensional microstructures. The main methods for preparing three-dimensional microstructures using micro-electrode discharge machining are: [0004] (1) Connect several layers of two-dimensional sheet electrodes to superimpose and fit a three-dimensional microelectrode, and use the three-dimensional microelectrode for electrical discharge machining...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23H9/00
Inventor 徐斌伍晓宇雷建国罗烽梁雄阮双琛
Owner 深圳市全达高分子材料科技有限公司
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