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Insulation pad and preparation method thereof

An insulating gasket and a thermally conductive powder technology are applied in the field of wave-absorbing and thermally-conducting insulating gaskets and their preparation, which can solve the problems of inability to realize thermal conductivity insulation and absorbing electromagnetic waves, and can not realize insulating gaskets at the same time, and achieve a simple and easy preparation process. Effect

Inactive Publication Date: 2013-11-27
KUSN ZHONGDI MATERIALS TECH
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  • Abstract
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Problems solved by technology

[0007] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an insulating gasket and its preparation method, aiming at solving the problem that the prior art cannot achieve thermal conduction insulation and absorb electromagnetic waves on the insulating gasket at the same time

Method used

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  • Insulation pad and preparation method thereof

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Embodiment

[0044] Raw material preparation

[0045] a. Silicone polymer:

[0046] a1, vinyl polysiloxane; a2, methyl vinyl polysiloxane.

[0047] b. Thermally conductive powder:

[0048] b1, alumina powder (D50=0.9μm); b2, alumina powder (D50=35μm);

[0049] b3. Aluminum oxide powder (D50=4.7μm). Among them, D50 represents the corresponding particle size when the cumulative particle size distribution percentage of a sample reaches 50%.

[0050] c. Absorbing powder

[0051] c1, hydroxyl iron powder (D50=6μm); c2, aluminum powder (D50=10μm);

[0052] d. The auxiliary agent is titanate coupling agent KR-TTS, whose scientific name is isopropyl tri(isostearyl) titanate. This coupling agent can be purchased from the market, and it belongs to the monoalkoxy type coupling agent.

[0053] After the above-mentioned heat-conducting powder and wave-absorbing powder are dried, the ratios in Table 1 are used for proportioning, and the surface treatment of the proportioned heat-conducting powder...

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Abstract

The invention discloses an insulation pad and a preparation method thereof. The insulation pad comprises the following components by weight percentage: 12-18 percent of silicone polymer or polyurethane and polymeric resin, 50-60 percent of heat conductive powder, 25-35 percent of wave absorption power, and adjuvant in balancing amount. The insulation pad has all the characteristics of a simple heat conductive insulation pad, meanwhile can absorb electromagnetic wave, and is easy in the preparation method and implement, safe and reliable.

Description

technical field [0001] The invention relates to the field of insulating materials, in particular to a wave-absorbing and heat-conducting insulating gasket and a preparation method thereof. Background technique [0002] With the development of integration technology and the intensive assembly of microelectronics, the heat generated by electronic equipment accumulates and increases rapidly. Every time the temperature of electronic components rises by 2°C, its reliability decreases by 10%. Therefore, whether it can dissipate heat in time becomes an important factor affecting its service life. [0003] In order to ensure that electronic components can still work with high reliability under the ambient temperature of use, it is necessary to develop thermally conductive and insulating polymer composite materials to replace traditional polymer materials as a thermally conductive interface material to quickly transfer heat from heating elements to heat dissipation equipment to prote...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08L83/06C08L75/04C08K13/06C08K9/10C08K3/22C08K3/28C08K3/38C08K3/18C08K3/08
Inventor 汪磊王晓南
Owner KUSN ZHONGDI MATERIALS TECH
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