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Photocurable/thermosetting inkjet composition, and printed wiring board using same

A printed circuit board, thermosetting technology, applied in the directions of printed circuit, printed circuit manufacturing, printing, etc., can solve the problems of peeling off the marking pattern, increasing the viscosity of the marking ink, and decreasing the adhesion between the marking pattern and the resin insulating layer, etc. Improved heat resistance, excellent chemical resistance, and excellent adhesion

Active Publication Date: 2013-11-20
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, in recent years, the demand for white marking ink used in the above-mentioned inkjet method has been increasing, but when titanium oxide, which is suitable as a white pigment, is compounded, the viscosity of the marking ink will increase
In addition, since the method of lowering the molecular weight of the resin composition is usually taken as a countermeasure, there are problems such as a decrease in the adhesion between the marking pattern and the resin insulating layer, and the marking pattern is peeled off from the resin insulating layer.
Therefore, there is no practical white marking ink that can be used by inkjet printers

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] Hereinafter, examples of the photocurable thermosetting composition for inkjet according to the first embodiment of the present invention are shown, and the present invention will be specifically described, but the present invention is not limited to these examples. In addition, unless otherwise indicated below, "part" means a mass part.

[0055] In Examples 1 to 5 and Comparative Examples 1 to 6, each component was blended in the ratio shown in Table 1, stirred with a dissolver, and filtered with a 1 μm disc filter to obtain each composition.

[0056] Table 1

[0057]

Example 1

Example 2

Example 3

Example 4

implement i5

Comparative example 1

Comparative example 2

Comparative example 3

Comparative example 4

Comparative Example 5

Comparative Example 6

GMA

40

30

50

40

40

4HBAGE

40

...

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PUM

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Abstract

Provided is a photocurable / thermosetting inkjet composition characterized in comprising: a monomer having a (meth)acryloyl group and a glycidyl group in the molecule thereof, and having a viscosity of 10 mPa°s or less at 25°C; a trifunctional or higher acrylate monomer; a heat-curing catalyst; and a photopolymerization initiator. Also provided is a photocurable / thermosetting inkjet composition obtained by including titanium oxide in the composition described above, and characterized in being used to draw a pattern on a resin insulation layer formed on a printed wiring board.

Description

technical field [0001] The present invention relates to a photocurable thermosetting composition, which is a photocurable thermosetting composition for forming a resin insulating layer, and a printed circuit board having a resin insulating layer formed using the same. It is a curable composition, and is suitable for directly drawing a pattern as an insulating layer or a mark on a substrate for a printed circuit board using an inkjet printer. Background technique [0002] As a method of manufacturing a printed circuit board using an inkjet printer, there is, for example, a method of forming a conductor circuit in which a resist layer is formed on a metal foil on a plastic substrate using an inkjet printer and an etching process is performed (refer to Japanese Patent Laying-Open No. 56- No. 66089, Japanese Patent Application No. 56-157089, Japanese Patent Application No. 58-50794, Japanese Patent Application No. 6-237063). This method draws the pattern directly on the metal f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/00H05K3/10
CPCH05K2203/013C09D11/101C09D11/30B41M5/00C08F2/44C09D11/00H05K3/10
Inventor 志村优之依田健志宇敷滋
Owner TAIYO INK MFG
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