A chip interface circuit pad driving method and device

Abstract

The application provides a driving method for interface circuits pads of a chip, which comprises the following steps: sending different driving signals to different pads by a sending unit; recording corresponding sending time when the sending unit sends different driving signals, and receiving time when each pad receives a respective corresponding driving signal; defining pads with same receiving time as to-be-processed pads; respectively calculating difference values of the receiving time and the sending time of driving signals corresponding to each recorded to-be-processed pad, and defining the difference values as receiving durations when the each to-be-processed pad receives the corresponding driving signal; adding different time delay for the receiving durations corresponding to the each to-be-processed pad respectively to allow the corresponding receiving time of each to-be-processed pad to differ from one another, and to be different from receiving time of respective corresponding driving signals received by pads outside the to-be-processed pads; therefore, the sso effect can be alleviated without increasing the chip cost.

Description

technical field [0001] The present application relates to the field of electronic information, in particular to a chip interface circuit pad driving method and device. Background technique [0002] The chip is the carrier of the integrated circuit, and the interface circuit pad of the chip is a part of the chip, which is used to receive the driving signal sent by the chip to complete the signal interaction between the chip and the outside world. [0003] After the pad receives the driving signal sent by the chip, it needs a large transient current to realize the level inversion of the received driving signal, so as to realize the signal interaction between the chip and the outside world. And because a chip includes multiple pads, when multiple pads need a large transient current to realize the level inversion of the received driving signal at the same time, multiple large transient currents will be generated, resulting in the state of the packaged chip. The inductance effec...

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Problems solved by technology

And because a chip includes multiple pads, when multiple pads need a large transient current to realize the level inversion of the received driving signal at the same time, multiple large transient currents will be generated, resulting in the state of the packaged chip. The inductance effect of the line is enhanced, which causes the voltage of the chip to change greatly, resulting in the sso (simultaneous switch output) effect, making the chip unable to work normally

[0004] At present, the inductance effect of the bonding wire of the packaged chip is reduced by increasing the number of power grounds connected to the chip to reduce the SSO effect. The same number of power ground pads and state wires of packaged chips will lead to an increase in the cost of the chip

[0005] It can be seen from the above that the existing technical solutions have the disadvantage of needing to increase the cost of the chip in order to reduce the sso effect

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