Hot melt adhesive

Abstract

The invention discloses a hot melt adhesive. The hot melt adhesive consists of the following materials in parts by weight: 89-92 parts of polyamide resin, 3-7 parts of paraffin, 3-7 parts of rosin ester-rosin glycerol resin, less than 0.5 part of organic silicon and less than 0.5 part of nitrate. The hot melt adhesive has the following advantages that firstly, the curing speed is quick, and the bonding strength and the flexibility are better; the hot melt adhesive can be used for curing and bonding within a fraction of second to a few seconds, and has the characteristics of being molten while being heated up and being bonded while being cooled, so that a packer using the hot melt adhesive can adopt a production line with higher speed, the yield can be increased while the defective goods are reduced, the continuous and automatic high-speed operation is convenient, and the cost is lower; secondly, the bonding power of the hot melt adhesive is very stable and not affected by morning-evening temperature and humidity changes in a working environment, so that the bonding firmness is ensured, and a bonding exposure problem of a packing machine is eliminated; and thirdly, the hot melt adhesive does not contain water and any other solvent. Besides, the hot melt adhesive is easy to transport and store, long in service life, capable of eliminating damages and waste, and convenient to use.

Description

Technical field: [0001] The invention belongs to the field of polymer materials, in particular to a hot melt adhesive. Background technique: [0002] Hot melt adhesive is an adhesive that is applied under molten conditions and hardens or crystallizes to develop strength. The coating of hot melt adhesives does not require solvents, and the market demand for hot melt adhesives is increasing. [0003] The existing hot melt has the following disadvantages: [0004] 1. Slow curing speed, poor bonding strength and poor flexibility, many defective products, low output and high cost. [0005] 2. The bonding strength of hot melt adhesive is unstable, and is affected by the temperature and humidity changes in the working environment in the morning and evening, which cannot guarantee the bonding fastness, and there is an inherent problem of bonding and peeling in packaging machinery. [0006] Aiming at this, so the inventor devises the present invention. Invention content: [000...

AI Technical Summary

Problems solved by technology

[0004] 1. Slow curing speed, poor bonding strength and poor flexibility, many defective products, low output and high cost

[0005] 2. The bonding force of hot melt adhesive is unstable, affected by the temperature and humidity changes in the morning and evening in the working environment, which cannot guarantee the bonding fastness, and there is an inherent problem of bonding and peeling in packaging machinery

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