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Separation mixed substrate for radio frequency application

A technology of mixing substrates and radio frequency signals, which is applied in the field of radio frequency signal systems and can solve problems such as the inability to provide radio frequency signal packaging systems.

Inactive Publication Date: 2013-10-23
HONG KONG APPLIED SCI & TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Even so, the prior art described above is not able to provide a package system for RF signals that simultaneously achieves optimum performance in terms of electrical characteristics, ultra-small form factor and low-cost solution

Method used

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  • Separation mixed substrate for radio frequency application
  • Separation mixed substrate for radio frequency application
  • Separation mixed substrate for radio frequency application

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Embodiment Construction

[0026] In the following description, a package for a radio frequency signal system is explained as a preferred example. It will be apparent to those skilled in the art that modifications including additions and / or substitutions can be made without departing from the scope and spirit of the present invention. Specific details may be omitted to avoid obscuring the invention; however, the disclosure is written to enable one skilled in the art to practice the teachings herein without undue experimentation.

[0027] figure 1 A package for a radio frequency (RF) signal system according to one embodiment of the invention is shown. The package 101 comprises a hybrid substrate with a sandwich structure comprising an upper layer 102 and a lower layer 103 with different dielectric properties. The upper layer 102 and the lower layer 103 are separated by an interposer 104 to improve the electrical isolation and mechanical strength of the package 101 . The interposer 104 has holes in whi...

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Abstract

The invention provides a method for packaging a small RF signal system and for forming packaging so that the packaging size can be minimized, signal integrity can be improved, and manufacturing cost can be lowered. The packaging comprises a mixed substrate with a sandwich structure, wherein the mixed substrate comprises an upper layer and a lower layer, and the upper layer and the lower layer are separated by a plug board and have different dielectric properties so that electrical isolation and mechanical strength can be improved. A metal layer is formed on the side wall of a hole so that an active element can be surrounded, and a self-shielding outer shell in the packaging can be formed by the metal side wall and two earth plates in the upper layer and the lower layer so that the active element can be protected.

Description

technical field [0001] The present invention relates generally to radio frequency signal systems, and more particularly to a package for a small radio frequency signal system and a method for producing the package. Background technique [0002] Currently, RF or mixed-signal systems in portable / wearable electronic devices urgently require heterogeneous integration (eg, integration of RF, digital, and power systems) and reduced form factors in order to meet the demand for miniaturized product size. Advanced packaging technologies such as three-dimensional packaging are possible solutions to achieve the above goals. [0003] RF and digital / power signal paths should be electrically separated for signal integrity concerns, and low-loss substrates such as low-temperature sintered ceramics are recommended for routing high-frequency or ultra-high-frequency signals. [0004] On the one hand, another key issue is that the radio frequency integrated circuit as a sensitive device shoul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/552H01L25/16H01L21/48H01L21/58H01Q1/22
CPCH01L24/97H01L21/568H01L2223/6677H01L2224/04105H01L2224/19H01L2224/73267H01L2224/97H01L2924/1423H01L2924/15311H01L2924/3025H01L2224/82H01L2224/83H01L2924/00012
Inventor 杨丹何松任宇行史训清
Owner HONG KONG APPLIED SCI & TECH RES INST
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