Defect casual inspection method capable of dynamically adjusting according to technology wafer number load

Abstract

The invention discloses a defect casual inspection method capable of dynamically adjusting according to the technology wafer number load. The method comprises the following steps: presetting a defect detection data server; inputting and storing standard casual inspection frequency of a defect detection station and operation speed ratios of different defect detection procedures at normal production time into the defect detection data server; the defect detection data server calculating the real-time capacity of the defect detection station according to the real-time state of each defect detection device in the defect detection station, and automatically upgrading the standard casual inspection frequency of the defect detection station. By the adoption of the method, the problem that dynamic changes of the defect detection capacity cause production speed to become slow and production cost to be increased is effectively avoided. The frequency of defect casual inspection is adjusted according to the dynamic changes of the technology wafer number load, so that integrated circuit production speed is effectively improved, the production period is shortened, and the production cost is eventually reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method for sampling wafer defects, in particular to a defect sampling inspection method that can be dynamically adjusted according to the number and load of process wafers. Background technique [0002] The manufacturing process of integrated circuits is very complicated. Simply put, it is to use various methods to form different "layers" on the substrate material (such as silicon substrate), and to dope ions in selected areas to change the semiconductor material. Conductivity, the process of forming a semiconductor device. This process requires many steps to complete. It takes hundreds of processes from wafer to finished integrated circuit. In the actual factory operation, the information automation between wafer and equipment and the execution of process steps are all centered on with the Manufacturing Execution System, such as figure 1 As shown, es...

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned problems, the present invention discloses a defect sampling inspection method that can be dynamically adjusted according to the load of the number of process wafers, so as to overcome the defects in the prior art when the defect inspection equipment stops production for some reason, and the sudden reduction in production capacity will lead to defect inspection. The number of wafers to be inspected at the site increases rapidly, which eventually leads to the lack of wafers to be processed in subsequent process machines, which makes the equipment idle, which is not conducive to the production cycle and cost control.

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