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Grapheme field effect transistor and preparation method thereof

A field-effect transistor and graphene technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of device performance degradation, reduce carrier mobility, etc., and achieve high dielectric constant and good top The effect of gate modulation capability and simple fabrication process

Active Publication Date: 2013-09-25
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter which treatment method is used, an additional scattering mechanism will be introduced to graphene, which will reduce the carrier mobility and degrade the device performance.

Method used

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  • Grapheme field effect transistor and preparation method thereof
  • Grapheme field effect transistor and preparation method thereof
  • Grapheme field effect transistor and preparation method thereof

Examples

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preparation example Construction

[0027] figure 2 It is prepared according to the embodiment of the present invention figure 1 The method flowchart of the shown graphene field effect transistor, the method may further comprise the steps:

[0028] Step 1: sequentially forming an insulating layer, a conductive channel made of graphene material, a source electrode and a drain electrode on the semiconductor substrate;

[0029] Step 2: grow graphene by metal-catalyzed CVD method, oxidize the graphene to obtain graphene oxide, transfer the graphene oxide to the source electrode, the drain electrode and the conductive channel between the source electrode and the drain electrode to form an oxide Graphene dielectric layer;

[0030] Step 3: Deposit a metal oxide dielectric layer on the graphene oxide dielectric layer by atomic layer deposition to form a gate dielectric layer composed of a graphene oxide dielectric layer and a metal oxide dielectric layer, and then on the gate dielectric layer A gate electrode is for...

Embodiment 1

[0033] Embodiment 1: a graphene field effect transistor with metal titanium / gold as the source and drain electrodes, graphene oxide and atomic layer deposition hafnium oxide as the gate dielectric layer, and metal titanium / gold as the gate electrode.

[0034] Concrete preparation steps are as follows:

[0035] Step S1: on the graphene material on the 100nm silicon dioxide / bulk silicon substrate sheet, after forming the source-drain electrode shape by electron beam lithography, the electron beam evaporates a layer of 10nm / 50nm thick titanium / gold (Ti / Au= 10 / 50nm) metal as the source-drain electrode, and then put the sample into acetone to peel off, remove the unnecessary metal layer, and obtain the source-drain metal electrode;

[0036] Step S2: Spin-coat PMMA photoresist on the surface of graphene grown by copper-catalyzed CVD and heat and bake to cure the photoresist, then put the copper sheet with graphene and PMMA glue into the nitric acid solution to corrode the copper and...

Embodiment 2

[0040] Embodiment 2: a graphene field effect transistor with metal titanium / gold as the source and drain electrodes, graphene oxide and atomic layer deposition hafnium oxide as the gate dielectric layer, and metal titanium / gold as the gate electrode.

[0041] The specific steps are similar to those in Example 1, but step S2 uses nickel-catalyzed CVD to grow graphene.

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Abstract

The invention discloses a grapheme field effect transistor and a preparation method of the grapheme field effect transistor, and belongs to the technical field of nano-electronics. The grapheme field effect transistor comprises a semiconductor substrate, an insulation layer, a conductive passage, a source electrode, a drain electrode, a grid medium layer and a grid electrode, wherein the insulation layer is formed on the semiconductor substrate, the conductive passage is formed in the insulation layer and is composed of grapheme materials, the source electrode and the drain electrode are respectively formed at the two ends of the conductive passage, the grid medium layer covers the source electrode, the drain electrode and the conductive passage between the source electrode and the drain electrode, and the grid electrode is located on the grid medium layer. The grapheme field effect transistor and the preparation method of the grapheme field effect transistor resolve the problem that a high dielectric constant grid medium film can not directly grow on the conductive passage formed by the grapheme materials by means of an atomic layer deposition method, the oxidized grapheme not only provides the nucleation center for deposition of an atomic layer, the carrier mobility of the grapheme materials will not obviously decrease at the same time, and the performance of elements will not decrease.

Description

technical field [0001] The invention belongs to the technical field of field-effect transistor manufacture, and in particular relates to a graphene field-effect transistor and a preparation method thereof. Background technique [0002] Since graphene was successfully developed in 2004, graphene electronic devices have made great progress. Graphene-based electronics has the characteristics of small size, high speed, low power consumption, and simple process, and has attracted more and more attention. Graphene is expected to replace silicon materials as the next generation of semiconductor materials. [0003] The performance of field effect transistors is affected by two most important factors, one is the material properties, which determine the potential of device performance; the other is the gate dielectric material, because it is in direct contact with the channel, so the performance of the gate dielectric will directly affect For the performance of the entire device, hig...

Claims

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Application Information

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IPC IPC(8): H01L29/78H01L29/51H01L21/336H01L21/285
Inventor 麻芃金智史敬元张大勇彭松昂陈娇
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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