Arc ion plating method combined with multi-stage magnetic field straight tube magnetic filtering and pulse bias
A technology of arc ion plating and arc plasma, which is applied in the field of material surface treatment, can solve problems such as large particles, and achieve the effects of increased target area, uniform target ablation, and high ionization rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0023] Specific implementation mode one: the following combination figure 1 and figure 2 Describe this embodiment, the device used in the arc ion plating method of multi-stage magnetic field straight tube magnetic filtering and pulse bias combination in this embodiment includes pulse bias power supply 1, multi-stage magnetic field straight tube magnetic filtering device 2, arc plasma power supply 3. Arc plasma target source 4, vacuum chamber 5 and sample stage 6, the method comprises the following steps:
[0024] Step 1. Place the workpiece to be processed on the sample stage 6 in the vacuum chamber 5, connect the workpiece to the pulse bias output end of the pulse bias power supply 1, and connect the arc plasma target source 4 installed on the vacuum chamber 5 to the arc plasma the output terminal of the power supply 3;
[0025] Step 2, film deposition: vacuumize the vacuum chamber 5 until the vacuum degree in the vacuum chamber 5 is less than 10 -2 When Pa, pass the work...
specific Embodiment approach 2
[0033] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a plurality of arc plasma power sources 3 are used to output the plasma of the low-melting point target material, combined with a multi-stage magnetic field straight tube magnetic filter device to perform multi-element multi-layer thin film deposition Step 1 to Step 2 are repeatedly performed to obtain multi-layer multilayer films with different element ratios, stress states and structural modulations, and the others are the same as Embodiment 1.
specific Embodiment approach 3
[0034] Specific Embodiment 3: The difference between this embodiment and Embodiment 1 is that step 3 is performed, and the thin film preparation process of traditional arc ion plating is performed.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com