Packaging structure for glass sealing electronic component

Abstract

The invention relates to an electronic component packaging structure and in particular relates to a packaging structure for a glass sealing electronic component. The packaging structure comprises a metal substrate, wherein a sealing hole is formed in the metal substrate; a lead is arranged in the sealing hole; glass is arranged between the lead and the wall of the sealing hole; the lead comprises an upper lead part of which the upper part is exposed out of the metal substrate and the surface of the glass and penetrates through the sealing hole; the upper lead part has a columnar structure; a lower lead part is connected to the lower part of the upper lead part; and the diameter of the upper lead part is larger than that of the lower lead part. According to the packaging structure for the glass sealing electronic component, the defects that the lead bonding is instable, the glass is cracked and broken, the gas tightness is low and the overall device is low in reliability in domestic similar electronic components are overcome. Compared with foreign similar electronic components, the packaging structure has the advantages that when the design is applied to a high-power packaging shell, the lead can be lower in loss by increasing the current to a certain degree.

Description

technical field [0001] The invention relates to a package structure of electronic components, in particular to a package structure of glass-sealed electronic components. Background technique [0002] When the chip is used, the chip must be isolated from the external environment to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation; on the other hand, the packaged chip is also easier to install and transport. Therefore, when a chip is used on a circuit board, it is generally necessary to package the chip. [0003] Packaging refers to connecting the circuit pins on the chip to external joints with wires so as to connect with other devices. The packaging form refers to the shell used to install the semiconductor integrated circuit chip. Protect the chip and enhance the electrothermal performance, etc., and connect the contacts on the chip to the pins of the package shell with wires, and these pins are connected to other...

AI Technical Summary

Problems solved by technology

However, considering the domestic processing capacity and processing cost of such leads, the economic applicability is not high; figure 2 In the packaging form of lead wires in China, the mechanical impact resistance of the joint between the glass and the lead wire after sintering is poor, which is easy to cause glass breakage or cracks, which affects the airtightness of the package, thereby affecting the stability of electronic components.

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