Automatic ball mounter for BGAs (ball grid arrays)

Abstract

The invention relates to an automatic ball mounter for BGAs (ball grid arrays). The automatic ball mounter comprises a framework; an industrial personal computer display screen, an emergency stop button, an industrial personal computer button, a start button, a pause button, an USB (universal serial bus) interface and a keyboard box are sequentially arranged at the front end of the framework from top to bottom and are close to the left side of the framework, a flap door, a placing window and a cost memory unit are sequentially arranged at the front end of the framework from top to bottom and are close to the right side of the framework, and cooling systems and a ventilating system are arranged on the top of the framework; and a BGA clamping device is connected with a conveying and feeding device, a light curtain detecting mechanism, an industrial camera photographing device and a turret mounting device are arranged on the left side of the conveying and feeding device, and a solidifying device and a solder paste adhering device are arranged on the right side of the conveying and feeding device. The automatic ball mounter has the advantages that solder balls are automatically sorted without a steel mesh and are prevented from scattering and being wasted; the automatic ball mounter can be automatically positioned, sizes and thicknesses of the BGAs can be automatically identified, and the squeezing quantity can be automatically adjusted; and the automatic ball mounter is simple in operation and high in automation degree, speed and precision, the cost is reduced, and the precision is guaranteed.

Description

technical field [0001] The invention relates to a BGA automatic ball planting machine. Background technique [0002] In recent years, due to the increasingly strong demand of electronic products for thin, light, high frequency, high efficiency and multi-function, BGA and CSP packaging have developed rapidly, and they have replaced the traditional pin packaging and lead frame packaging technology, which makes a A new packaging material that plays the role of electrical interconnection and mechanical support - solder balls came out. Packaged devices such as BGA and CSP connected by solder balls have been widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. At present, the existing BGA chip solder ball packaging process is to scrape a layer of solder paste on the BGA chip, squeeze the solder ball through the corresponding steel mesh ball table, and then stabilize and solidify, which can only be done manually. . For BGAs of different sizes, it i...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a BGA automatic ball planting machine to overcome the above-mentioned shortcomings of relying on manual completion, complicated process and frequent missing ball planting in the current prior art

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